Multilayer Ceramic Substrate

Khoom Paub meej

Lub npe: Ceramic substrate

Khoom siv: Ceramic

Board thickness: 1.6 hli

Kev kho saum npoo: ENIG

Technology: Stack up N plus N, Min Track/Width 3/3mil, dig muag & faus vias, laser vias

Kev Them Nyiaj: L / C, T / T, Western Union

Daim ntawv pov thawj: UL Consumer (hnav, Electronic Digital, Cov Khoom Siv Hauv Tsev, Cov Khoom Sib Txuas) / Kev Tswj Xyuas Kev Lag Luam / Tsheb TS16949 / Kev Kho Mob / Server, Cloud Computing & Base Station / Aviation / Tub Rog / Kev Sib Txuas Lus (Certification in Related Applications)

Lub sij hawm xa tuaj: DDU, FOB, CFA, CIF, CPT, EXW

Dab tsi yog Ceramic Substrate

1. Raws li cov khoom siv

(1) Al2O3

Alumina substrate yog cov khoom siv feem ntau siv hauv kev lag luam hluav taws xob, vim tias nws muaj lub zog siab thiab tshuaj lom neeg ruaj khov piv rau lwm cov oxide ceramics feem ntau ntawm cov khoom siv hluav taws xob, thermal thiab hluav taws xob, thiab muaj cov khoom siv raw, tsim rau ntau yam. ntawm kev tsim khoom raws li cov duab sib txawv.

(2) PEB

Nws muaj cov thermal conductivity ntau dua li cov hlau txhuas thiab siv nyob rau hauv lub sijhawm uas yuav tsum tau muaj thermal conductivity, tab sis nws txo qis sai tom qab qhov kub siab tshaj 300 degree. Qhov tseem ceeb tshaj plaws yog tias nws toxicity txwv nws txoj kev loj hlob.

(3) ALN

AlN muaj ob yam tseem ceeb heev uas tsim nyog sau cia: lub siab thermal conductivity, thiab qhov sib piv nthuav dav coefficient nrog Si. Qhov tsis zoo yog tias txawm tias cov txheej oxide nyias nyias ntawm qhov chaw yuav muaj kev cuam tshuam rau thermal conductivity, thiab tsuas yog kev tswj nruj ntawm cov ntaub ntawv thiab cov txheej txheem tuaj yeem tsim AlN substrates nrog zoo sib xws. Txawm li cas los xij, nrog kev txhim kho ntawm kev lag luam thiab kev txhim kho thev naus laus zis, lub hwj chim no yuav ploj mus.

Raws li cov laj thawj saum toj no, nws tuaj yeem paub tias alumina ceramics tseem siv dav hauv microelectronics, hluav taws xob hluav taws xob, hybrid microelectronics, fais fab modules thiab lwm yam lag luam vim lawv cov kev ua tau zoo tshaj plaws.

2. Raws li kev tsim khoom

Tam sim no, muaj tsib hom ceramic heat dissipation substrates: HTCC, LTCC, DBC, DPC, thiab LAM. Ob lub HTCC thiab LTCC yog cov txheej txheem sintering, thiab tus nqi yuav siab dua.

Txawm li cas los xij, DBC thiab DPC yog kev tsim kho hauv tsev thiab cov thev naus laus zis rau kev tsim hluav taws xob hauv xyoo tas los no. DBC siv cov cua kub kub los ua ke Al2O3 thiab Cu daim hlau. Cov kev tsis sib haum xeeb yog tias nws nyuaj los daws qhov teeb meem ntawm micro pores ntawm Al2O3 thiab Cu daim hlau. , uas ua rau lub zog ntau lawm thiab tawm los ntawm cov khoom no nyuaj heev, thaum DPC thev naus laus zis siv tooj liab plating tshuab ncaj qha los tso Cu rau ntawm Al2O3 substrate. Cov txheej txheem sib txuas cov ntaub ntawv thiab cov yeeb yaj kiab nyias. Nws cov khoom yog Cov feem ntau siv ceramic tshav kub dissipation substrate nyob rau hauv xyoo tas los no. Txawm li cas los xij, nws cov khoom siv tswj thiab cov txheej txheem thev naus laus zis kev sib koom ua ke muaj peev xwm ua tau zoo, uas ua rau kev nkag mus rau DPC kev lag luam thiab kev tsim khoom ruaj khov kuj siab. LAM thev naus laus zis tseem hu ua laser nrawm ua kom metallization tshuab.

(1) HTCC (High-Temperature Co-fired Ceramic)

HTCC kuj tseem hu ua kub kub co-txheej txheem ntau txheej ceramics. Cov txheej txheem tsim khoom zoo ib yam li LTCC. Qhov sib txawv tseem ceeb yog tias cov hmoov ceramic ntawm HTCC tsis ntxiv nrog cov khoom siv iav. Yog li, HTCC yuav tsum tau qhuav thiab tawv ntawm qhov kub ntawm 1300 ~ 1600 degree. Tom qab ntawd lub embryo ntsuab yog drilled nrog rau ntawm lub qhov, thiab lub qhov thiab luam circuits yog sau nrog tshuaj ntsuam luam ntawv technology. Vim yog qhov kub siab co-firing, kev xaiv cov khoom siv hlau yog txwv. Cov khoom tseem ceeb yog cov ntsiab lus siab melting tab sis cov khoom siv hlau xws li tungsten, molybdenum, manganese ...

(2) LTCC (Low-Temperature Co-fired Ceramic)

LTCC tseem hu ua qhov kub tsis tshua muaj hluav taws xob ntau txheej txheej ceramic substrate. Nyob rau hauv cov cuab yeej no, inorganic alumina hmoov thiab txog 30 feem pua ​​​​~ 50 feem pua ​​​​cov khoom siv iav ntxiv rau cov organic binder yog thawj zaug sib xyaw los ua cov av nkos slurry. Siv lub scraper los txhuam cov slurry rau hauv flakes, thiab tom qab ntawd dhau los ntawm cov txheej txheem ziab kom tsim cov flake slurry rau hauv nyias ntsuab embryos, thiab tom qab ntawd laum los ntawm qhov raws li tus tsim ntawm txhua txheej, raws li cov teeb liab kis ntawm txhua txheej, sab hauv. Circuit Court ntawm LTCC Tom qab ntawd, kev tshuaj ntsuam luam ntawv thev naus laus zis yog siv los sau cov qhov thiab luam tawm circuits ntawm lub embryo ntsuab, raws li, thiab sab hauv thiab sab nrauv electrodes tuaj yeem ua los ntawm cov nyiaj, tooj liab, kub thiab lwm yam hlau raws. Sintering thiab molding nyob rau hauv ib lub qhov cub sintering tuaj yeem ua tiav.

(3) DBC (Direct Bonded Copper)

Cov txheej txheem tooj liab ncaj qha yog txhawm rau txuas ncaj qha tooj liab ntawm cov ceramic los ntawm kev siv cov pa oxygen uas muaj eutectic kua ntawm tooj liab. Lub hauv paus ntsiab lus tseem ceeb yog qhia txog qhov tsim nyog ntawm cov pa oxygen ntawm cov tooj liab thiab cov ceramic ua ntej lossis thaum lub sij hawm sib txuas. Nyob rau hauv qhov ntau ntawm degree, tooj liab thiab oxygen tsim ib tug Cu-O eutectic kua. DBC thev naus laus zis siv cov kua eutectic no los ua tshuaj lom neeg nrog cov ceramic substrate los tsim CuAlO2 lossis CuAl2O4 theem, thiab ntawm qhov tod tes, infiltrate cov ntawv ci tooj liab kom paub txog kev sib xyaw ntawm ceramic substrate thiab tooj liab phaj.

Superiority

◆ Lub thermal expansion coefficient ntawm ceramic substrate yog ze rau ntawm silicon nti, uas tuaj yeem txuag Mo nti ntawm cov txheej txheem hloov, txuag zog, khoom siv thiab nqi;

◆ Txo cov txheej txheem, txo cov thermal tsis kam, txo cov voids, thiab txhim kho yield;

◆ Nyob rau tib lub peev xwm nqa tam sim no, kab dav ntawm 0.3mm tuab tooj liab ntawv ci tsuas yog 10 feem pua ​​​​ntawm cov ntawv luam tawm zoo tib yam;

◆ Zoo heev thermal conductivity ua lub nti heev compact, yog li lub zog hluav taws xob tau txhim kho heev, thiab kev ntseeg tau ntawm cov kab ke thiab khoom siv tau txhim kho;

◆ Ultra-nyias (0.25mm) ceramic substrate tuaj yeem hloov BeO, tsis muaj teeb meem toxicity;

◆ Lub peev xwm nqa tam sim no loj, 100Ib tam sim no tsis tu ncua hla 1mm dav 0.3mm tuab tooj liab lub cev, qhov kub thiab txias yog li 17 degree; 100A tam sim no tsis tu ncua hla 2 hli dav 0.3 hli tuab lub cev tooj liab, qhov kub nce tsuas yog li 5 degree;

◆ Tsawg thermal tsis kam, thermal kuj ntawm 10 × 10mm ceramic substrate yog 0.31K/W, thermal kuj ntawm 0.63mm tuab ceramic substrate yog {{10}}.31K/W, thermal kuj ntawm 0.38mm tuab ceramic substrate yog 0.19K/W, thiab thermal kuj ntawm 0.25mm tuab ceramic substrate Thermal kuj yog 0.14 K/W.

◆ Cov rwb thaiv tsev siab tiv taus hluav taws xob kom ntseeg tau tias muaj kev nyab xeeb ntawm tus kheej thiab cov khoom siv tiv thaiv.

◆ Kev ntim khoom tshiab thiab kev sib dhos tuaj yeem ua tiav, kom cov khoom sib xyaw ua ke thiab qhov ntim tau txo.

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