Ultra Nyias Flexible PCB

Ultra nyias flexible pcb yog qhov sib txuas siab ceev, lub teeb yuag, nyias thickness thiab zoo khoov tau. Txhua qhov FPC xav tau, thov koj xav tiv tauj peb.

Xa kev nug

Hauj lwm lawm

Product details

Ultra nyias saj zawg zog pcb muaj peev xwm:

Cov khoom siv hauv paus: FR4 Tg 130, Tg 150, Tg 170, Tg 180, thiab BT khoom.

Board Thickness: {{0}}.076 ~ 0.3 hli

Copper thickness: 0.5 OZ, 1 OZ, 2 OZ, 3 OZ

Cov txheej txheem: Routing, xuas nrig ntaus, V-txiav, laser txiav

Solder mask: Liab / Dawb / Dub / Xiav / Ntsuab / Liab Roj

Lus dab neeg / Silkscreen Xim: Dub / Dawb

Nto xov: Immersion Kub, OSP, ENEPIG, HAL-LF (tsis nrov)

Max vaj huam sib luag loj: 500 * 650 hli, los yog 1200 * 450 hli

Min vaj huam sib luag loj: 25 * 25 mm

Min ib qhov loj me: 3.0*3.0 mm

Min vias: 0.1 hli

Min qhov chaw / qhov dav: 2.2mil / 2.2mil

Packing: Nqus

Qauv L / T: 3 ~ 4 Hnub

Batch xaj L / T: 8 ~ 10 Hnub

Ultra thin flexible PCB board

Cov yam ntxwv ntawm cov khoom siv hluav taws xob hloov tau yooj yim

⒈ Luv: Lub sij hawm sib dhos luv luv, tag nrho cov kab tau teeb tsa, thiab kev sib txuas ua haujlwm ntawm cov kab hluav taws xob rov qab raug tshem tawm;

⒉Small: Lub ntim yog me dua nruj PCB, uas tuaj yeem txo cov khoom ntim thiab ua kom yooj yim ntawm kev nqa;

⒊ Lub teeb: lub teeb yuag dua nruj PCB tuaj yeem txo qhov hnyav ntawm cov khoom kawg;

4. Nyias: Lub thickness yog thinner dua nruj PCB, uas tuaj yeem txhim kho qhov muag muag thiab ntxiv dag zog rau kev sib dhos ntawm peb qhov chaw nyob hauv qhov chaw txwv.

Hom khoom siv substrate rau hloov pauv tau PCBs

Ultra thin flexible PCB

(1) Matrix:

Cov khoom tseem ceeb tshaj plaws nyob rau hauv ib qho yooj yim PCB los yog nruj PCB yog nws cov khoom siv substrate. Nws yog cov khoom siv uas tag nrho PCB sawv. Nyob rau hauv nruj PCBs, cov khoom siv substrate feem ntau yog FR-4. Txawm li cas los xij, hauv Flex PCB, feem ntau siv cov ntaub ntawv substrate yog polyimide (PI) zaj duab xis thiab PET (polyester) zaj duab xis, ntxiv rau qhov no, cov yeeb yaj kiab polymer xws li PEN (polyethylene phthalate) kuj tuaj yeem siv Diester), PTFE thiab Aramid thiab lwm yam.

Polyimide (PI) "thermoset resins" tseem yog cov khoom siv feem ntau siv rau Flex PCBs. Nws muaj lub zog tensile zoo heev, ruaj khov tshaj qhov kev ua haujlwm kub ntau ntawm -200 OC rau 300 OC, tshuaj lom neeg tsis kam, hluav taws xob zoo heev, ua haujlwm siab thiab ua haujlwm kub zoo heev. Tsis zoo li lwm cov thermoset resins, nws khaws nws cov elasticity txawm tias tom qab thermal polymerization. Txawm li cas los xij, PI resins muaj qhov tsis zoo ntawm lub zog tsim kua muag thiab kev nqus dej siab. PET (polyester) resins, ntawm qhov tod tes, muaj cov cua sov tsis zoo, "ua rau lawv tsis tsim nyog rau kev sib txuas ncaj qha", tab sis muaj hluav taws xob zoo thiab cov khoom siv kho tshuab. Lwm lub substrate, PEN, muaj kev ua haujlwm nruab nrab theem zoo dua PET, tab sis tsis zoo dua PI.

(2) Liquid Crystal Polymer (LCP) Substrates:

LCP yog cov khoom siv substrate nrov heev hauv Flex PCBs. Qhov no yog vim nws kov yeej qhov tsis txaus ntawm PI substrates thaum tuav tag nrho cov khoom ntawm PI. LCP muaj 0.04 feem pua ntawm cov dej noo thiab noo noo tsis kam thiab dielectric tsis tu ncua ntawm 2.85 ntawm 1 GHz. Qhov no ua rau nws nto moo nyob rau hauv high-speed digital circuits thiab high-frequency RF circuits. Daim ntawv molten ntawm LCP, hu ua TLCP, tuaj yeem txhaj tshuaj molded thiab nias rau hauv PCB hloov tau yooj yim thiab tuaj yeem rov ua dua tshiab.

(3) Resin:

Lwm cov khoom siv yog cov resin uas nruj nreem khi cov ntawv ci tooj liab thiab cov khoom siv hauv paus ua ke. Cov resin tuaj yeem yog PI resin, PET resin, hloov kho epoxy resin thiab acrylic resin. Cov resin, tooj liab ntawv nyiaj (sab saum toj thiab hauv qab) thiab substrate tsim ib lub qhaub cij hu ua "laminate". Cov laminate no, hu ua FCCL (Flexible Copper Clad Laminate), yog tsim los ntawm kev siv qhov kub thiab txias rau "pawg" los ntawm kev siv lub tshuab nias hauv qhov chaw tswj. Ntawm cov lus hais no, hloov kho epoxy resins thiab acrylic resins muaj zog nplaum.

Yog li kev daws teeb meem no yog siv 2- txheej FCCL yam tsis muaj nplaum. 2L FCCL muaj cov khoom siv hluav taws xob zoo, ua kom sov siab thiab ruaj khov zoo, tab sis nws cov khoom siv yog qhov nyuaj thiab kim.

(4) Copper ntawv ci:

Lwm cov khoom siv sab saum toj hauv flex PCBs yog tooj liab. PCB kab, kab, cov ntaub qhwv, vias thiab qhov tau ntim nrog tooj liab ua cov khoom siv hluav taws xob. Peb txhua tus paub txog cov khoom siv hluav taws xob ntawm tooj liab, tab sis yuav ua li cas luam cov kab tooj liab ntawm PCB tseem yog qhov kev sib tham. Muaj ob txoj kev tso nyiaj tooj liab ntawm 2L-FCCL (2-txheej txheem tooj liab clad laminate) substrates. 1- Electroplating 2- Lamination. Cov txheej txheem electroplating muaj cov nplaum tsawg, thaum laminates muaj cov nplaum.

(5) Plating:

Nyob rau hauv cov ntaub ntawv uas yuav tsum tau ultra-nyias Flex PCB, cov pa txheej txheem ntawm laminating tooj liab ntawv ci ntawm PI substrate los ntawm resin nplaum yog tsis haum. Qhov no yog vim cov txheej txheem lamination muaj 3- txheej txheej, piv txwv li (Cu-Adhesive-PI) ua rau cov txheej txheej txheej tuab dua, yog li nws tsis pom zoo rau ob sab FCCL. Yog li ntawd, lwm txoj kev hu ua "sputtering" yog siv, uas tooj liab yog sputtered ntawm PI txheej los ntawm ntub los yog qhuav txoj kev los ntawm "electroless" electroplating. Qhov no electroless plating deposits ib tug nyias txheej ntawm tooj liab (cov noob txheej), thaum lwm txheej ntawm tooj liab yog deposited nyob rau hauv ib kauj ruam tom ntej hu ua "electroplating", qhov twg ib tug thicker txheej ntawm tooj liab yog tso rau ib tug nyias txheej ntawm tooj liab (cov noob txheej. ) txheej). Txoj kev no tsim kom muaj kev sib raug zoo ntawm PI thiab tooj liab tsis tas siv cov nplaum nplaum.

(6) Laminated:

Nyob rau hauv txoj kev no, PI substrates yog laminated nrog ultra-thin tooj liab foils los ntawm ib txheej txheej. Coverlay yog ib zaj duab xis sib xyaw uas cov thermoset epoxy nplaum yog coated rau ntawm polyimide zaj duab xis. Cov nplaum nplaum no muaj qhov ua kom sov zoo thiab cov hluav taws xob zoo hluav taws xob, nrog rau flexing, nplaim taws retardant thiab qhov sib txawv filling zog. Ib hom tshwj xeeb ntawm daim npog hu ua "Photo Imageable Coverlay (PIC)" muaj qhov adhesion zoo, zoo flex kuj thiab ib puag ncig tus phooj ywg. Txawm li cas los xij, qhov tsis zoo ntawm PIC yog qhov tsis zoo thaum tshav kub kub thiab tsis muaj iav hloov pauv kub (Tg)

(7) Roll Annealed (RA) thiab Electrodeposited (ED) Copper Foils:

The main difference between the two is their manufacturing process. ED copper foil is made from CuSO4 solution by electrolytic method, in which Cu2+ is dipped into a rotating cathode roll and stripped, and then ED copper is made. While RA copper of different thicknesses is made from high purity copper (>99.98 feem pua) los ntawm cov txheej txheem nias.

FAQ

Q1.Dab tsi yog qhov xav tau rau FPC / PCB / PCBA hais?

A: FPC: gerber cov ntaub ntawv, kom muaj nuj nqis

PCB: Ntau, PCB cov ntaub ntawv (Gerber file) thiab cov kev xav tau (cov khoom siv, tooj liab thickness, board thickness, deg kho tiav ...)

PCBA: Ntau, PCB cov ntaub ntawv (Gerber file) thiab cov kev xav tau (khoom siv, tooj liab thickness, board thickness, nto kho tiav ...), BOM

Q2: Lub sijhawm ua haujlwm yog dab tsi?

(1) Qauv

1-2 Txheej: 5 mus rau 7 hnub ua haujlwm

4-8 Txheej: 10 hnub ua haujlwm

(2) Ntau lawm: 2-3lub lis piam, 3-4 lis piam

Q3: Koj qhov kev txiav txim yam tsawg kawg nkaus (MOQ) yog dab tsi?

A: Tsis muaj MOQ, peb tuaj yeem txhawb koj cov haujlwm los ntawm cov qauv mus rau cov khoom loj