English
עברית
Melayu
Norsk
日本語
فارسی
Italiano
suomi
Gaeilgenah Éireann
Català
hrvatski
Eesti
HTCC thiab LTCC yog dab tsi
May 19, 2022
Nrog kev nce thiab siv cov khoom siv hluav taws xob, tshwj xeeb tshaj yog tiam thib peb cov khoom siv hluav taws xob, cov khoom siv semiconductor maj mam txhim kho nyob rau hauv cov kev taw qhia ntawm lub zog siab, miniaturization, kev sib koom ua ke, thiab kev ua haujlwm ntau, uas tseem tso siab rau cov kev xav tau ntau dua rau kev ua haujlwm ntawm cov khoom ntim substrates. Ceramic substrates muaj cov yam ntxwv ntawm cov thermal conductivity, zoo tshav kub tsis kam, thermal expansion coefficient, siab mechanical zog, zoo rwb thaiv tsev, corrosion kuj, hluav taws xob tsis kam, thiab lwm yam, thiab yog dav siv nyob rau hauv electronics ntim khoom.
Ntawm lawv, kev sib koom ua ke ntau txheej ceramic substrates tau maj mam nrov thiab siv rau hauv cov khoom siv hluav taws xob siab vim tias lawv tuaj yeem raug rho tawm haujlwm ib zaug rau cov khoom siv hluav taws xob, cov khoom siv hluav taws xob, thiab cov khoom siv hluav taws xob kom ua tiav kev sib koom ua ke.
Co-fired multi-layer ceramic substrates yog ua los ntawm ntau cov txheej txheem ceramic substrates los ntawm lamination, kub nias, degumming, sintering thiab lwm yam txheej txheem. Txij li tus naj npawb ntawm cov khaubncaws sab nraud povtseg tuaj yeem ua tau ntau dua, cov xov hlau ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntim tuaj yeem tsim tau ntau qhov ntau thiab tsawg. Yog li ntawd, nws tuaj yeem ua tau raws li qhov yuav tsum tau ua ntawm lub tshuab hluav taws xob tag nrho rau Circuit Court miniaturization, siab ceev, ntau txoj haujlwm, kev ntseeg siab, kev kub ceev thiab lub zog siab.
Raws li qhov sib txawv ntawm qhov kub thiab txias ntawm cov txheej txheem kev npaj, co-fired ceramic substrates tuaj yeem muab faib ua high-temperature co-fired ceramic (HTCC) multilayer substrates thiab low-temperature co-fired ceramic (LTCC) Multilayer substrate.
(a) HTCC ceramic substrate khoom (b) LTCC ceramic substrate khoom
Yog li dab tsi yog qhov txawv ntawm ob lub thev naus laus zis no?
Qhov tseeb, cov txheej txheem tsim khoom ntawm ob lub hauv paus yog tib yam. Lawv txhua tus yuav tsum tau mus los ntawm kev npaj slurry, casting ntsuab daim kab xev, ziab lub cev ntsuab, drilling ntawm qhov, tshuaj ntsuam luam ntawv thiab sau qhov, tshuaj ntsuam luam ntawv circuits, lamination sintering, thiab thaum kawg slicing thiab lwm yam kev npaj tom qab. txheej txheem. Txawm li cas los xij, HTCC thev naus laus zis yog kev siv hluav taws xob sib txuas nrog qhov kub thiab txias siab tshaj 1000 degree. Feem ntau, kev kho debinding yog ua los ntawm qhov kub qis dua 900 degree, thiab tom qab ntawd sintered ntawm qhov kub thiab txias ntawm 1650 txog 1850 degree. Piv nrog rau HTCC, LTCC muaj qhov qis sintering kub, feem ntau qis dua 950 degree. Vim yog qhov tsis zoo ntawm qhov kub thiab txias, kev siv hluav taws xob loj, thiab cov khoom siv hlau tsis tshua muaj nyob ntawm HTCC substrates, kev txhim kho ntawm LTCC thev naus laus zis tau nce.
Hom Multilayer Ceramic Substrate Manufacturing Txheej txheem
Qhov sib txawv ntawm sintering kub ua ntej cuam tshuam rau kev xaiv ntawm cov ntaub ntawv, uas nyob rau hauv lem cuam tshuam cov khoom ntawm cov khoom npaj, uas ua rau ob yam khoom yog haum rau txawv daim ntawv thov cov lus qhia.
Vim yog qhov kub thiab txias ntawm HTCC substrates, tsis tshua muaj melting point hlau cov ntaub ntawv xws li kub, nyiaj, thiab tooj liab siv tsis tau. Cov khoom siv hlau refractory xws li tungsten, molybdenum, thiab manganese yuav tsum tau siv. Tus nqi tsim khoom yog siab, thiab hluav taws xob conductivity ntawm cov ntaub ntawv no tsawg, uas yuav ua rau lub teeb liab qeeb. thiab lwm yam tsis xws luag, yog li nws tsis haum rau high-speed los yog high-frequency micro-assembled circuit substrates. Txawm li cas los xij, vim tias qhov kub ntawm cov khoom siv ntau dua sintering, nws muaj zog dua txhua yam, thermal conductivity thiab tshuaj stability. Nyob rau tib lub sijhawm, nws muaj qhov zoo ntawm cov khoom siv dav, tus nqi qis, thiab kev xaim hluav taws xob siab. , Lub zog ntim khoom ntim nrog ntau dua thermal conductivity, sealing thiab kev ntseeg siab yuav tsum muaj ntau qhov zoo.
LTCC substrate yog los txo qhov kub ntawm sintering los ntawm kev ntxiv amorphous iav, crystallized iav, qis melting point oxide thiab lwm yam ntaub ntawv rau cov ceramic slurry. Cov hlau xws li kub, nyiaj thiab tooj liab nrog cov hluav taws xob hluav taws xob siab thiab qis melting point tuaj yeem siv los ua cov khoom siv hluav taws xob. Nws tsis tsuas yog txo tus nqi, tab sis kuj tau txais kev ua haujlwm zoo. Thiab vim qhov tsis tshua muaj dielectric tsis tu ncua thiab siab zaus thiab tsis tshua muaj kev ua haujlwm ntawm cov iav ceramics, nws yog qhov tsim nyog rau daim ntawv thov hauv xov tooj cua zaus, microwave thiab millimeter yoj pab kiag li lawm. Txawm li cas los xij, vim qhov sib ntxiv ntawm cov ntaub ntawv iav rau cov ceramic slurry, lub thermal conductivity ntawm lub substrate yuav qis, thiab qis sintering kub kuj ua rau nws cov neeg kho tshuab zog qis dua HTCC substrate.
Yog li, qhov sib txawv ntawm HTCC thiab LTCC tseem yog qhov xwm txheej ntawm kev lag luam tawm hauv kev ua haujlwm. Txhua tus muaj nws qhov zoo thiab qhov tsis zoo, thiab nws yog ib qho tsim nyog los xaiv cov khoom tsim nyog raws li kev thov tshwj xeeb.
Qhov txawv HTCC thiab LTCC
Lub npe | HTCC | LTCC |
Cov khoom siv dielectric substrate | Alumina, Mullite, Aluminium Nitride, thiab lwm yam. | (1) Cov ntaub ntawv iav-ceramic; (2) Cov ntaub ntawv iav ntxiv rau cov khoom siv ceramic; (3) Cov khoom siv iav amorphous |
Cov khoom siv hlau conductive | Tungsten, molybdenum, manganese, molybdenum-manganese, thiab lwm yam. | Nyiaj, Kub, Tooj, Platinum-Silver, thiab lwm yam. |
Co-firing kub | 1650 degree - 1850 degree | 950 degree hauv qab no |
Qhov zoo | (1) Lub zog siv tshuab siab dua; (2) Ntau dua qhov kub dissipation coefficient; (3) Cov khoom siv qis dua; (4) Cov khoom siv tshuaj ruaj khov; (5) Cov kab hluav taws xob siab ceev | (1) High conductivity; (2) Tus nqi tsim khoom tsawg; (3) Me me thermal expansion coefficient thiab dielectric tas li thiab yooj yim hloov ntawm dielectric tas li; (4) Kev ua haujlwm siab zaus; (5) Vim tsis tshua muaj sintering kub, muaj peev xwm encapsulate ib co Cheebtsam |
Daim ntawv thov | Kev ntseeg siab microelectronic integrated circuits, high-power micro-assembled circuits, automotive high-power circuits, thiab lwm yam. | High-frequency wireless kev sib txuas lus, aerospace, nco, tsav, lim, sensors, thiab automotive electronics |
Hauv luv luv, HTCC substrates yuav ua lub luag haujlwm tseem ceeb hauv kev ntim khoom hluav taws xob rau lub sijhawm ntev vim qhov zoo ntawm cov cuab yeej paub tab thiab cov khoom siv hluav taws xob pheej yig. Nws qhov zoo ntawm ntuj yuav yog qhov tseem ceeb dua, thiab nws yog qhov tsim nyog rau txoj kev loj hlob ntawm cov zaus, kev kub ceev thiab lub zog siab. Txawm li cas los xij, ntau yam khoom siv substrate muaj lawv tus kheej qhov zoo thiab qhov tsis zoo. Vim muaj kev sib txawv ntawm daim ntawv thov Circuit Court, qhov kev ua tau zoo ntawm cov khoom siv substrate kuj txawv. Yog li ntawd, ntau yam khoom siv substrate yuav coexist thiab tsim ua ke rau lub sijhawm ntev.
