Yog vim li cas tooj liab raug nyob rau hauv cov cua kub theem txheej txheem ntawm rigid-flex PCB

Cua kub leveling yog rau raus rau hauv lub Circuit Court board nyob rau hauv lub molten solder, thiab ces tshuab tawm ntau tshaj solder rau nws nto thiab nyob rau hauv lub metallization qhov nrog kub cua, thiaj li yuav tau ib tug du, uniform thiab kaj solder txheej nrog zoo weldability thiab kiag li dawb ntawm raug tooj liab. Copper raug rau saum npoo ntawm lub ncoo thiab nyob rau hauv lub qhov metallization tom qab cua kub leveling yog ib qho tseem ceeb tsis xws luag nyob rau hauv lub tiav lawm tshuaj ntsuam xyuas cov khoom, thiab yog ib qho ntawm feem ntau yog vim li cas rau huab cua kub leveling rework. Yog li, dab tsi yog vim li cas rau huab cua kub leveling thiab tooj liab raug ntawm cov mos mos thiab tawv composite daim hlau?

1. Tsis txaus pretreatment thiab tsis zoo coarsening. Qhov zoo ntawm cov cua kub leveling pretreatment txheej txheem muaj kev cuam tshuam zoo rau qhov zoo ntawm cov cua kub leveling. Cov txheej txheem no yuav tsum tau tshem tawm tag nrho cov greasy av, impurities thiab oxide txheej ntawm daim ntawv cog lus kom muab cov tshiab thiab solderable tooj liab nto rau tin dipping. Tam sim no cov txheej txheem pretreatment feem ntau yog siv tshuab txau. Copper exposure tshwm sim los ntawm kev tsis zoo pretreatment tshwm sim nyob rau hauv ib tug loj tus naj npawb, thiab cov ntsiab lus tooj liab feem ntau faib thoob plaws hauv lub rooj tsavxwm, tshwj xeeb tshaj yog nyob rau ntawm ntug. Nyob rau hauv cov xwm txheej zoo sib xws, tshuaj ntsuam xyuas yuav tsum tau ua nyob rau hauv cov tshuaj micro etching, xyuas qhov thib ob pickling tov, kho cov concentration ntawm cov tshuaj, hloov cov tshuaj uas muaj kuab paug loj vim lub sij hawm siv ntev, thiab xyuas seb cov tshuaj tsuag puas. du. Kev ncua sij hawm kho kom zoo tuaj yeem txhim kho kev kho mob.

2. Qhov saum npoo ntawm lub ncoo yog qias neeg, thiab muaj cov khoom seem uas tsis muaj kuab paug rau lub ncoo. Feem ntau cov chaw tsim khoom siv puv board screen luam tawm cov kua photosensitive solder tiv thaiv tus number case, thiab tom qab ntawd tshem tawm cov khoom siv ntau dhau los ntawm kev raug thiab kev loj hlob kom tau txais cov qauv ntawm lub sijhawm. Txawm hais tias muaj qhov tsis xws luag ntawm lub ntsej muag lub ntsej muag, seb qhov muaj pes tsawg leeg thiab qhov kub thiab txias ntawm tus tsim tawm yog qhov tseeb, thiab seb qhov kev loj hlob ceev, uas yog, qhov kev loj hlob taw tes, yog qhov tseeb. Ib qho ntawm cov xwm txheej no yuav tso cov khoom seem ntawm lub ncoo. Nyob rau hauv kev tsim ntawm cov mos mos thiab tawv bonding board, ib tug ncej yuav tsum tau teem rau xyuas cov duab thiab sab hauv ntawm lub metallized lub qhov ua ntej lub curing txheej txheem, thiaj li yuav xyuas kom meej tias lub solder ncoo thiab metallized qhov ntawm lub luam Circuit Court board xa mus rau. cov txheej txheem tom ntej no yog huv si thiab tsis muaj solder resist ink residue.

3. Lub flux tsis nquag txaus. Lub luag haujlwm ntawm flux yog los txhim kho wettability ntawm tooj liab nto, tiv thaiv lub laminate nto los ntawm overheating, thiab muab kev tiv thaiv rau solder txheej. Yog hais tias qhov kev ua ntawm cov flux tsis txaus thiab cov wettability ntawm tooj liab nto tsis zoo, lub solder tsis tuaj yeem npog tag nrho lub ncoo, thiab qhov tshwm sim ntawm cov tooj liab raug zoo ib yam li cov neeg pluag pretreatment. Ntev lub sij hawm pretreatment tuaj yeem txo qhov tshwm sim ntawm tooj liab. Cov kev xaiv ntawm qhov ruaj khov thiab txhim khu kev qha flux los ntawm cov txheej txheem cov kws tshaj lij muaj qhov cuam tshuam tseem ceeb ntawm huab cua kub leveling, thiab zoo heev flux yog lav ntawm huab cua kub leveling zoo.