Yog vim li cas nws thiaj li nyuaj ua ntau txheej PCB boards

Nrog rau kev txhim kho cov ntaub ntawv xov xwm hauv hluav taws xob, ntau thiab ntau lub teb siv ntau txheej PCB boards. Kev lig kev cai, peb txhais cov PCB boards nrog ntau tshaj 4 txheej raws li "multilayer PCB boards", thiab ntau tshaj 10 txheej raws li "high multi-layer PCB boards". Txawm hais tias nws tuaj yeem tsim cov txheej txheem ntau txheej PCB boards yog ib qho tseem ceeb rau kev ntsuas lub zog ntawm PCB pawg thawj coj saib. Nws tuaj yeem tsim cov txheej txheem ntau txheej txheej nrog ntau tshaj 20 txheej, uas yog suav tias yog lub tuam txhab PCB nrog lub zog siab tshaj plaws.

1. Cov teeb meem tseem ceeb ntawm kev tsim khoom

Piv nrog rau cov pa hluav taws xob, cov khoom siv hluav taws xob hauv high-theem muaj cov khoom tuab, ntau txheej, cov kab denser thiab vias, chav tsev loj dua, thinner dielectric txheej, thiab lwm yam, qhov chaw sab hauv, interlayer alignment, impedance tswj thiab kev ntseeg tau. Kev sib deev yuav tsum nruj dua.

(1) Qhov nyuaj hauv kev sib xyaw ua ke

Vim muaj coob tus txheej txheem siab siab, cov neeg siv khoom tsim sab muaj ntau thiab ntau qhov kev xav tau ntawm kev ua kom zoo ntawm txhua txheej ntawm PCB. Feem ntau, qhov kev sib haum xeeb ntawm cov khaubncaws sab nraud povtseg yog tswj rau ± 75μm. Yam xws li dislocation stacking thiab interlayer positioning txoj kev tshwm sim los ntawm inconsistency ntawm expansion thiab contraction ntawm txawv core board txheej ua rau nws nyuaj rau tswj lub interlayer kev sib raug zoo ntawm high-rise boards.

(2) Kev nyuaj hauv kev ua cov txheej sab hauv

Lub rooj tsavxwm siab tau txais cov ntaub ntawv tshwj xeeb xws li TG siab, kev kub ceev, siab zaus, tuab tooj liab, thiab nyias dielectric txheej, uas tso rau pem hauv ntej siab yuav tsum tau rau sab hauv txheej Circuit Court ntau lawm thiab graphic loj tswj. Cov kab dav thiab kab sib nrug me me, qhov qhib thiab luv Circuit Court nce, micro-shorts nce, thiab tus nqi dhau yog tsawg; muaj ntau lub teeb liab txheej ntawm cov kab zoo, thiab qhov tshwm sim ntawm kev soj ntsuam tsis zoo ntawm cov txheej sab hauv AOI nce; Lub thickness ntawm lub rooj tsavxwm puab yog nyias, uas yog ib qho yooj yim rau wrinkle, ua rau tsis zoo raug thiab etching. Nws yooj yim rau dov lub rooj tsavxwm thaum lub tshuab dhau lawm; tus nqi ntawm scrapping cov khoom tiav yog tus nqi siab.

(3) Nyuaj hauv kev nias

Ntau lub hauv paus tseem ceeb thiab cov prepregs yog superimposed, thiab cov teeb meem xws li zawv zawg daim hlau, delamination, resin voids thiab npuas residues yog nquag tshwm sim thaum lub sij hawm lamination. Thaum tsim cov qauv laminated, nws yog ib qho tsim nyog yuav tsum xav txog tag nrho cov cua kub tsis kam, tiv taus qhov hluav taws xob, cov kua nplaum txhaws thiab dielectric thickness ntawm cov khoom, thiab teeb tsa cov txheej txheem siab tsim nyog.

(4) Qhov nyuaj hauv kev tsim khoom drilling

Kev siv cov high-TG, high-speed, high-frequency, thiab tuab tooj liab tshwj xeeb daim hlau ua rau kom qhov nyuaj ntawm drilling roughness, drilling burrs thiab decontamination. Tus naj npawb ntawm cov khaubncaws sab nraud povtseg yog qhov loj, qhov sib ntxiv ntawm tag nrho tooj liab thickness thiab phaj thickness, thiab cov cuab yeej drilling yog ib qho yooj yim tawg; muaj ntau BGAs ntom, thiab CAF tsis ua hauj lwm teeb meem tshwm sim los ntawm qhov nqaim qhov sib nrug ntawm phab ntsa; qhov teeb meem inclined drilling yog yooj yim los ntawm lub phaj thickness.

2. Tswj cov txheej txheem tsim khoom tseem ceeb

(1) Kev xaiv cov khoom siv

Cov khoom siv hluav taws xob hauv hluav taws xob yuav tsum muaj qhov tsis tshua muaj hluav taws xob tsis tu ncua thiab dielectric poob, nrog rau qis CTE, tsis tshua muaj dej nqus thiab zoo dua cov khoom siv tooj liab clad laminate kom ua tau raws li qhov yuav tsum tau ua thiab kev ntseeg siab ntawm cov boards qib siab.

(2) Laminated qauv tsim

Cov ntsiab lus tseem ceeb hauv kev tsim cov qauv laminated yog cov cua sov ntawm cov khoom siv, kev tiv thaiv hluav taws xob, cov kua nplaum filling thiab thickness ntawm dielectric txheej, thiab lwm yam. Cov ntsiab lus tseem ceeb hauv qab no yuav tsum ua raws li:

ib. Prepreg thiab core board manufacturers yuav tsum sib xws. Txhawm rau kom ntseeg tau qhov kev ntseeg siab ntawm PCB, tag nrho cov txheej txheem prepreg yuav tsum tsis txhob siv ib leeg 1080 lossis 106 prepreg (tshwj tsis yog cov neeg siv khoom muaj cov cai tshwj xeeb).

b. Thaum tus neeg siv khoom xav tau daim ntawv siab TG, lub rooj tsav xwm tseem ceeb thiab lub prepreg yuav tsum siv cov khoom siv siab TG.

c. Rau sab hauv substrates ntawm 3OZ los yog siab dua, siv prepregs nrog cov ntsiab lus siab resin, tab sis sim zam cov qauv tsim ntawm kev siv tag nrho 106 high-resin prepregs.

d. Yog tias tus neeg siv khoom tsis muaj qhov tshwj xeeb yuav tsum tau ua, lub thickness kam rau ua ntawm cov txheej txheej interlayer dielectric feem ntau yog tswj los ntawm ntxiv /-10 feem pua. Rau cov phaj impedance, lub dielectric thickness kam rau ua yog tswj los ntawm IPC -4101 C / M chav kawm kam rau ua, yog tias qhov impedance cuam tshuam cuam tshuam nrog lub thickness ntawm lub substrate, lub phaj tolerances kuj yuav tsum ua raws li IPC{ {2}} C/M chav kawm kam rau ua.

(3) Interlayer alignment tswj

Qhov tseeb ntawm qhov loj me me ntawm cov txheej txheem txheej txheej hauv lub rooj tsavxwm thiab kev tswj ntawm qhov loj me yuav tsum tau them nyiaj kom raug rau cov duab loj ntawm txhua txheej ntawm lub rooj tsavxwm siab los ntawm cov ntaub ntawv khaws cia hauv kev tsim khoom thiab kev paub txog cov ntaub ntawv keeb kwm rau ib lub sij hawm ntawm lub sij hawm, thiaj li ua kom lub expansion thiab contraction ntawm lub core board ntawm txhua txheej. sib xws.

(4) Txheej txheej txheej txheej txheej txheej txheej

Txij li thaum lub peev xwm daws teeb meem ntawm lub tshuab raug tshuaj yog hais txog 50μm, rau kev tsim cov boards qib siab, lub laser direct imaging tshuab (LDI) tuaj yeem qhia tau los txhim kho cov duab daws teeb meem, thiab kev daws teeb meem muaj peev xwm ncav cuag li 20μm. Qhov kev sib raug zoo ntawm lub tshuab raug raug yog ± 25μm, thiab qhov kev sib raug zoo ntawm cov txheej txheem yog ntau dua 50μm; siv lub tshuab ua kom muaj kev sib raug zoo siab, cov qauv kev sib raug zoo tuaj yeem nce mus txog 15μm, thiab kev sib raug zoo ntawm interlayer raug tswj tsis pub dhau 30μm.

(5) Nias txheej txheem

Tam sim no, interlayer positioning txoj kev ua ntej lamination mas muaj xws li: plaub-qhov chaw (Pin LAM), kub yaj, rivet, kub yaj thiab rivet ua ke. Cov khoom sib txawv siv cov txheej txheem sib txawv. Rau cov laug cam siab, siv plaub-qhov chaw txoj kev, los yog siv txoj kev fusion ntxiv rau riveting. OPE xuas nrig ntaus tshuab xuas nrig ntaus tawm ntawm qhov chaw, thiab kev xuas nrig ntaus raug tswj ntawm ± 25μm.

Raws li cov qauv laminated ntawm lub rooj tsavxwm siab thiab cov ntaub ntawv siv, kawm txog cov txheej txheem lamination tsim nyog, teeb tsa cov cua kub zoo tshaj plaws thiab nkhaus, txo cov cua sov ntawm daim ntawv lamination, ua kom lub sijhawm kub kub, ua kom cov resin. ntws thiab kho tag nrho, thiab tsis txhob nias cov teeb meem xws li zawv zawg phaj thiab interlayer dislocation thaum lub sij hawm ua ke.

(6) Drilling txheej txheem

Vim lub superposition ntawm txhua txheej, lub phaj thiab tooj liab txheej yog super tuab, uas yuav hnyav hnav lub laum me ntsis thiab yooj yim tawg lub laum hniav. Tus naj npawb ntawm qhov, poob ceev thiab kev sib hloov ceev yuav tsum tau kho kom haum. Ntsuas ntsuas qhov nthuav dav thiab kev cog lus ntawm lub rooj tsavxwm thiab muab cov coefficients raug; tus naj npawb ntawm cov khaubncaws sab nraud povtseg ntau dua los yog sib npaug rau 14 txheej, lub qhov taub yog tsawg dua los yog sib npaug rau 0.2mm, los yog qhov deb ntawm lub qhov rau kab yog tsawg dua los yog sib npaug rau 0. 175 hli. Step-by-step drilling, nrog lub thickness-rau-inch ratio ntawm 12: 1, yog tsim los ntawm step-by-step drilling, zoo thiab tsis zoo drilling txoj kev; tswj lub taub hau thiab lub qhov tuab, thiab siv lub laum tshiab los yog kev sib tsoo rau cov laug cam kom ntau li ntau tau, thiab lub qhov tuab yog tswj nyob rau hauv 25um.

3. Kev ntsuam xyuas kev ntseeg siab

High-rise boards yog tuab, hnyav dua, thiab muaj chav tsev loj dua li cov pa ntau txheej boards, thiab cov khoom siv hluav taws xob sib xws kuj loj dua. Thaum lub sij hawm vuam, yuav tsum muaj cua sov ntau dua thiab lub vuam kub kub lub sij hawm tau ntsib ntev dua. Nws yuav siv sij hawm 50 vib nas this mus rau 90 vib nas this ntawm 217 degree (lub melting point ntawm tin-silver-tooj ​​liab solder), thiab lub txias npaum li cas ntawm lub high-qib pawg thawj coj saib kuj qeeb, yog li lub sij hawm rau lub reflow xeem yog ntev.