Dab tsi yog HDI Circuit Board

HDI Circuit Board yog cov lus Askiv luv ntawm High Density Interconnector. High Density Interconnection (HDI) kev tsim khoom yog ib qhov chaw loj hlob sai tshaj plaws hauv kev lag luam luam tawm Circuit Board.

cov khoom piav qhia

HDI is the English abbreviation of High Density Interconnector, and high-density interconnect (HDI) manufacturing is one of the fastest growing areas in the printed circuit board industry. From HP's first 32-bit computer in 1985, to today's large client servers with 36 sequentially laminated multi-layer printed boards and stacked micro-vias, HDI/micro-via technology is undoubtedly the PCB architecture of the future. Larger ASICs and FPGAs with smaller device pitches, more I/O pins, and embedded passives have increasingly shorter rise times and higher frequencies, all of which require smaller PCB feature sizes, driving demand for Strong demand for HDI/micro vias. HDI process

Thawj- txheej txheem xaj: 1 ntxiv rau N ntxiv 1

Thib ob - txheej txheem xaj: 2 ntxiv rau N ntxiv 2

Peb- txheej txheem theem: 3 ntxiv rau N ntxiv 3

Plaub- theem txheej txheem: 4 ntxiv rau N ntxiv 4