Dab tsi yog Dielectric Constant

Txij li cov ntaub ntawv fpc tau muab faib ua ob hom, polyimide (Polyimide) thiab polyester (Polyester), peb yuav tsum cais lawv ntawm no.

1. Polyimide

Polyimide (PI for short) is the most commonly used thermally cured insulating material in flexible circuit processing. Material thicknesses typically range from 12.5 μm (0.5 mil) to 125 μm (5 mil). Divided into glued and glueless, the dielectric constant of glued is 3.5, and the dielectric constant of no glue is 3.3.

2. Polyester

Polyester is made of polyethylene terephthalate (PET for short, polyethylene terephthalate). The thickness range of its application to flexible boards is generally 25μm (1mil) 125μm (5mil). It has the same excellent softness and electrical properties as Polyimide.

Txawm li cas los xij, nws qhov kev ruaj ntseg nyob rau lub sijhawm tsim khoom yog me ntsis phem dua li ntawm Polyimide. Tsis tas li ntawd, nws muaj cov kua muag tsis zoo thiab muaj kev nkag siab ntau dua rau qhov kub thiab txias. Nws qhov dielectric tsis tu ncua yog 3.4.

Cov saum toj no yog qhov dielectric tas li ntawm fpc board hloov tau muab tso ua ke los ntawm tus editor, kuv vam tias nws yuav pab tau koj