Qhov txawv ntawm FCBGA Pob thiab BGA yog dab tsi

Tau ntau xyoo lawm, chip ntim tshuab tau ua raws li kev txhim kho ntawm IC. Txhua tiam ntawm IC muaj ib lub cim sib txuas ntawm cov tshuab ntim khoom kom phim.

Txhawm rau tiv thaiv cov kev cai nruj ntawm kev ntim khoom sib txuas thiab kev nce ceev ntawm cov I / O tus pins, ua rau muaj zog siv zog, hauv xyoo 1990, BGA (pob daim phiaj array lossis solder pob array) ntim tau los ua.

Kev Siv Tshuab BGA yog qhov siab-ntom npoo av mounting ntim tshuab: hauv qab pins: hauv qab pins ntawm lub nti yog pob thiab npaj hauv cov duab puab. Piv nrog rau kev ntim khoom siv tshuab, BGA ntim tau zoo dua cov cua sov dissipation, kev ua haujlwm hluav taws xob thiab me me. Lub cim xeeb ntim nrog BGA thev naus laus zis tuaj yeem txo qhov loj rau ib feem peb yam tsis tau hloov lub peev xwm nco.

BGA ntim yog ib qho tseem ceeb ntawm kev tsim cov chips tam sim no.

BGA ntim kev faib tawm thiab cov yam ntxwv

BGA pob tuaj yeem muab faib ua hom staggered, tag nrho array hom, thiab peripheral hom raws li kev npaj ntawm cov khoom siv.

Raws li daim ntawv ntim khoom, nws tuaj yeem muab faib ua TBGA, CBGA, FCBGA, thiab PBGA.

TBGA:

Carrier daim kab xev solder pob array yog ib daim ntawv tshiab ntawm BGA ntim. Nws siv cov khoom siv qis-melting-point solder alloy thaum lub sij hawm vuam, cov khoom siv pob khoom yog cov khoom siv high-melting-point solder alloy, thiab cov substrate yog PI multi-txheej hlau substrate.

Nws muaj qhov zoo hauv qab no:

① Yuav kom ua tau raws li qhov yuav tsum tau ua ntawm lub pob solder thiab lub ncoo, qhov kev sib txuas ntawm tus kheej ntawm lub pob solder yog siv los luam qhov nro ntawm lub pob solder thaum lub sij hawm reflow soldering txheej txheem.

② Cov kab xev hloov pauv tau yooj yim ntawm lub pob tuaj yeem muab piv nrog cov thermal txuam ntawm PCB pawg thawj coj saib.

③Nws yog pob BGA kev lag luam.

④ Piv nrog PBGA, qhov kev ua kom sov ua kom zoo dua.

Pob renderings

CBGA:

Ceramic solder pob array yog daim ntawv ntim khoom qub tshaj plaws BGA. Lub substrate yog ntau txheej ceramic. Txhawm rau tiv thaiv cov nti, txhuas thiab cov ntaub qhwv, cov hlau npog yog welded rau lub substrate nrog sealing solder.

Nws muaj qhov zoo hauv qab no:

① Piv nrog PBGA, qhov kev ua kom sov ua kom zoo dua.

② Piv nrog PBGA, nws muaj cov khoom siv hluav taws xob zoo dua.

③ Piv nrog PBGA, qhov ntim ntim ntau dua.

④ Vim nws cov dej noo tsis kam thiab zoo huab cua nruj, kev cia siab rau lub sij hawm ntev ntawm cov khoom ntim yog siab dua li ntawm lwm cov khoom ntim.

FCBGA:

Flip chip pob grid array yog qhov tseem ceeb tshaj plaws ntim hom rau cov duab acceleration chips.

Nws muaj qhov zoo hauv qab no:

① daws cov teeb meem ntawm electromagnetic cuam tshuam thiab electromagnetic compatibility.

② Lub nraub qaum ntawm lub nti yog nyob rau hauv kev sib cuag nrog cov huab cua, ua kom sov dissipation ntau npaum.

③Nws tuaj yeem ua kom qhov ntom ntom ntawm I / O thiab tsim cov kev siv zoo tshaj plaws, yog li txo qhov ntim ntawm FC-BGA los ntawm 1/3 ~ 2/3 piv nrog cov ntim khoom ib txwm muaj.

Yeej, txhua daim duab accelerator daim npav siv FC-BGA ntim.

PBGA:

Yas solder pob array pob, siv cov yas epoxy molding compound raws li cov khoom sib khi, siv BT resin / iav laminate ua lub substrate, cov pob solder yog eutectic solder 63Sn37Pb lossis quasi-eutectic solder 62Sn36Pb2Ag

Nws muaj qhov zoo hauv qab no:

① Zoo thermal txuam.

② Kev ua haujlwm hluav taws xob zoo.

③ Qhov nro ntawm lub pob molten solder tuaj yeem ua tau raws li qhov yuav tsum tau ua ntawm cov pob solder thiab lub ncoo.

④ Tus nqi qis dua.