Txhua Txheej HDI PCB

Product Detail

(Txhua txheej HDI) yog txheej txheem HDI siab kawg. Qhov txawv yog tias, feem ntau HDI, lub tshuab laum hauv cov txheej txheem drilling ncaj qha nkag mus rau cov txheej txheem ntawm PCB txheej, thaum Txhua-txheej HDI siv laser drilling kom tau los ntawm cov khaubncaws sab nraud povtseg. Rau kev sib txuas ntawm cov khaubncaws sab nraud povtseg, tooj liab ntawv ci substrate tuaj yeem raug tshem tawm rau qhov nruab nrab substrate, uas tuaj yeem ua rau cov khoom tuab thiab sib dua. Hloov ntawm HDI thawj-txiav mus rau Txhua-txheej HDI tuaj yeem txo qhov ntim tau ze li 40 feem pua.

Tsis muaj

Txheej: 14 txheej HDI txhua txheej PCB

Board Thickness: 1.6 hli

Min qhov: 0.2mm

Yam tsawg kawg kab dav / Clearance: {0}}.075mm / 0.075mm

Yam tsawg kawg nkaus Clearance ntawm Inner Layer PTH thiab Kab: 0.2mm

Loj: 107.61mm × 123.45mm

Aspect ratio: 10: 1

Kev kho deg: ENEPIG ntxiv rau Kub ntiv tes

Tshwj xeeb: Txhua txheej hdi pcb, cov khoom siv ceev ceev, tawv kub plating rau ntug connectors, insertion poob xeem, Z-axis milling, Laser ntawm tooj liab plated kaw

Txheej Txheem Tshwj Xeeb: Thickness ntawm Kub ntiv tes: 12 "

Txawv impedance 100 ntxiv rau 7 / -8Ω

Daim ntawv thov: Optical module

Txhua txheej HDI PCB nta

(1) Laser drilling qhib qhov kev sib txuas ntawm cov khaubncaws sab nraud povtseg, thiab tooj liab-clad substrate tuaj yeem raug tshem tawm rau qhov nruab nrab substrate, uas tuaj yeem ua rau cov khoom tuab thiab sib dua. Hloov ntawm HDI thawj zaug rau kev siv Txhua-txheej HDI tuaj yeem txo ze li 40 feem pua ​​​​ntawm qhov ntim ib puag ncig;

(2) Lub interlayer alignment txais lub hauv paus txheej raws li tus neeg nqa khoom, thiab cov khaubncaws sab nraud povtseg tom qab tau ua raws li cov txheej txheem pem hauv ntej los ntawm txheej, thiab qhov zoo tshaj plaws interlayer alignment raug ncav cuag 10 microns;

(3) Cov wiring ntom thiab lub qhov ntom ntom yog siab dua cov kev xav tau ntawm me me, sib zog thiab thisner HDI cov laug cam yav tom ntej.

Txhua txheej HDI PCB Manufacturing txheej txheem:

(1) Siv cov epoxy tooj liab clad substrate (FR-4) ua txheej txheej, ua ntej tho qhov sib dhos los ntawm cov tshuab drilling, thiab tom qab ntawd muab tshuaj txhuam cov yeeb yaj kiab qhuav rau saum npoo. Qhov ua micro-qhov;

(2) Siv cov kab rov tav electroplating qhov filling txoj kev los sau cov laser qhov los tsim qhov qhov muag tsis pom;

(3) Cov duab hloov pauv yog tsim los ntawm cov yeeb yaj kiab thiab CCD kev sib raug zoo los ua ib lub voj voog; nyob rau tib lub sij hawm, lub hom phiaj ntawm cov txheej txheem tom ntej yog pauv mus rau lub hauv paus txheej;

(4) Siv cov txheej txheem prepreg lamination, cov ntawv ci tooj liab yog ua los ntawm electrolytic tooj liab ntawv ci nrog lub thickness ntawm 12 microns, thiab qib tom ntej yog tsim los ntawm nias lub phaj txheej txheej;

(5) Los ntawm X-RAY qhov pom kev pom qhov system, lub hom phiaj raug tho tawm raws li lub hom phiaj ntawm qib tom ntej;

(6) los ntawm acid etching cov tshuaj, cov ntawv ci tooj liab yog me ntsis etched mus rau 8 microns nrog cov tuab tuab;

(7) Laser lub teeb-absorbing txheej fabrication (xim av los yog blackening); ces ua micro-qhov los ntawm cov txheej txheem ntawm ncaj qha xuas nrig ntaus tooj liab los ntawm laser; h. Rov ua cov kauj ruam b mus rau g kom txog rau thaum qib yuav tsum tau ua tiav; cov saum toj no yog qhov tshwj xeeb kev siv ntawm patent ntawm tam sim no invention. Kev piav qhia, tab sis patented creation ntawm tam sim no invention tsis txwv rau cov piav qhia, thiab cov neeg txawj nyob rau hauv cov kos duab yuav ua tau ntau yam sib npaug deformations los yog hloov tsis tau ua txhaum tus ntsuj plig ntawm patent ntawm lub invention tam sim no, thiab cov sib npaug deformations los yog hloov tag nrho. suav nrog nyob rau hauv qhov uas tau teev tseg los ntawm kev thov ntawm daim ntawv thov tam sim no.

a. Lub epoxy tooj liab clad substrate (FR-4) yog siv los ua lub hauv paus txheej; cov micro-qhov yog tsim los ntawm laser;

b. Siv cov kab rov tav electroplating qhov filling txoj kev los sau lub laser qhov los ua qhov muag tsis pom qhov;

c. Cov duab hloov pauv los ntawm cov yeeb yaj kiab thiab CCD kev sib raug zoo raug tsim los ua ib lub voj voog;

d. Siv cov txheej txheem prepreg lamination (los ntawm nias lub phaj txheej txheem) los ua qib tom ntej;

e. Qhov thib ob-txiav micro-qhov yog tom qab ntawd ua los ntawm laser, thiab cov kauj ruam b, c thiab d rov ua dua kom txog thaum cov txheej yuav tsum tau ua tiav. Txoj kev ua no yog siv rau kev tsim cov HDI boards nrog arbitrary interconnection ntawm kab.

FAQs

Q1. Dab tsi yog qhov xav tau rau PCB / PCBA hais?

A: PCB: Kom muaj nuj nqis, Gerber cov ntaub ntawv thiab cov kev xav tau (cov khoom siv, kev kho deg, tooj liab thickness, board thickness, ...)

PCBA: Cov ntaub ntawv PCB, BOM, (Cov ntaub ntawv kuaj...)

Q2. Cov ntaub ntawv dab tsi koj txais rau PCB PCBA ntau lawm?

A: Gerber cov ntaub ntawv: CAM350 RS274X

PCB cov ntaub ntawv: Protel 99SE, P-CAD 2001 PCB

BOM: Excel (PDF, lo lus, txt)

Q3. Kuv cov ntaub ntawv puas muaj kev nyab xeeb?

A: Koj cov ntaub ntawv muaj nyob hauv kev nyab xeeb thiab kev nyab xeeb. Peb yuav tiv thaiv cov cuab yeej txawj ntse rau peb cov neeg siv khoom tag nrho

txheej txheem. Tag nrho cov ntaub ntawv los ntawm cov neeg siv khoom yeej tsis muab faib rau lwm tus neeg sab nrauv.

Q4. MOQ?

A: Tsis muaj MOQ hauv Beton. .

Q5. Tus nqi thauj khoom?

A: Tus nqi thauj khoom yog txiav txim siab los ntawm qhov chaw, qhov hnyav, ntim loj ntawm cov khoom. Thov qhia rau peb paub yog tias koj xav tau peb

hais koj tus nqi shipping.

Cim npe nrov: txhua txheej hdi pcb, Tuam Tshoj, lwm tus neeg, manufacturers, hoobkas, customized, yuav, pheej yig, quotation, luv nqi, dawb qauv