Aluminium substrate txheej txheem ntws

1. Qhib

Aluminium substrate txheej txheem ntau lawm

1. Cov txheej txheem ntawm kev txiav cov khoom - txiav

2. Lub hom phiaj ntawm kev qhib

Txiav loj - cov khoom loj tuaj mus rau qhov loj me uas xav tau rau kev tsim khoom

3. Kev ceev faj rau cov ntaub ntawv qhib

① Check the size of the first piece after cutting

② Pay attention to the scratches on the aluminum surface and the scratches on the copper surface

③ Pay attention to the layering and draping of the edge of the board

2. Drilling

1. Drilling txheej txheem

Doweling - Drilling - Pawg Tswj Xyuas

2. Lub hom phiaj ntawm drilling

Qhov chaw thiab drilling ntawm lub phaj los pab cov txheej txheem tsim khoom thiab cov neeg siv khoom sib dhos

3. Kev ceev faj rau qhov drilling

① Check the number of drilled holes and the size of the holes

② Avoid scratches on the sheet

③ Check the drape of the aluminum surface and the deviation of the hole position

④ Check and replace the drill bit in time

⑤ Drilling is divided into two stages, one drilling: after cutting the material, the drilling is a peripheral tool hole

Kev xyaum thib ob: lub cuab tam lub qhov hauv chav tsev tom qab lub npog ntsej muag

3. Dry/wet film imaging

1. Qhuav / ntub zaj duab xis txheej txheem

Sib tsoo phaj - zaj duab xis - raug - kev loj hlob

2. Lub hom phiaj ntawm cov duab qhuav / ntub dej

Cov khoom uas xav tau los ua lub voj voog yog muab tso rau ntawm daim ntawv

3. Kev ceev faj rau kev yees duab qhuav / ntub dej

① Check whether there is an open circuit in the circuit after developing

② Whether there is any deviation in the development alignment to prevent the occurrence of dry film breakage

③ Pay attention to the defective circuit caused by scratches on the board surface

④ There should be no air residue during exposure to prevent poor exposure

⑤ After exposure, keep it still for more than 15 minutes before developing

4. Acid/Alkaline Etching

1. Acid/Alkaline etching txheej txheem

Etching - stripping - ziab - board tshuaj ntsuam

2. Lub hom phiaj ntawm acid/alkaline etching

Tom qab ntsuas cov yeeb yaj kiab qhuav / ntub dej, khaws qhov yuav tsum tau ua ntawm lub voj voog, tshem tawm qhov seem sab nraud ntawm lub voj voog, thiab xyuam xim rau corrosion ntawm aluminium substrate los ntawm cov tshuaj etching thaum lub sij hawm acid etching;

3. Ceev faj rau acid/alkaline etching

① Note that the etching is not clean and the etching is excessive

② Pay attention to line width and line thickness

③ The copper surface is not allowed to be oxidized or scratched

④ The dry film should be removed cleanly

Tsib, silk screen solder mask, cim

1. Silk screen solder daim npog qhov ncauj, txheej txheem ua cim

Silkscreen - Ua ntej- ci - Tawm - Kev loj hlob - Cim

2. Lub hom phiaj ntawm silk screen solder daim npog qhov ncauj thiab cov cim

① Anti-soldering: protect the circuit that does not need to be soldered and prevent the tin from entering and causing a short circuit

② Characters: play the role of marking

3. Cov teeb meem xav tau kev saib xyuas rau silk screen solder daim npog qhov ncauj thiab cov cim

① To check whether there is garbage or foreign matter on the board

COB aluminium substrate

COB aluminium substrate

② Check the cleanliness of the stencil ③ Pre-bake for more than 30 minutes after screen printing to avoid bubbles in the lines

④ Pay attention to the thickness and uniformity of the silk screen

⑤ After pre-baking, the board should be completely cooled to avoid sticking to the film or destroying the gloss of the ink surface.

⑥ Place the ink face down during development

6. V-CUT, Gong board

1. V-CUT, txheej txheem ntawm lub rooj tsavxwm

V-CUT——Gong board——Tear off protective film——Remove Pifeng

2, V-CUT, lub hom phiaj ntawm lub rooj tsavxwm

① V-CUT: Connect a single PCS line to the whole PNL plate cutting and leave a small part for easy packaging and removal.

② gong board: remove the excess part of the circuit board

3. Kev ceev faj rau V-CUT thiab lub rooj tsavxwm

① During the V-CUT process, pay attention to the size of V, incomplete edges and burrs

② Pay attention to burrs when the gong board is used, and the gong knife is skewed. Check and replace the gong knife in time.

③ Finally, avoid scratches on the board when removing the front.

Xya, test, OSP

1. Kev xeem, OSP txheej txheem

Kab Test - Ntsuas qhov ntsuas hluav taws xob - OSP

2. Kev xeem, lub hom phiaj ntawm OSP

① Line test: check whether the completed line is working normally

② Withstand voltage test: check whether the completed line can withstand the specified voltage environment

③ OSP: Make the circuit better for soldering

3, kuaj, OSP ceev faj

① How to distinguish between qualified and unqualified products after testing

② Placement after finishing OSP

③ Avoid line damage

Yim, FQC, FQA, ntim, shipping

1. Txheej txheem

FQC - FQA - Ntim - Kev xa khoom

2. Lub hom phiaj

① FQC conducts full inspection and confirmation of the product

② FQA random inspection and verification

③ Pack and ship to customers as required

3. Ua tib zoo mloog

① FQC pays attention to the confirmation of appearance during the visual inspection process and makes a reasonable distinction

② FQA really conducts random inspections to verify the inspection standards of FQC

③ To confirm the number of packages, avoid mixed boards, wrong boards and package damage 3