Dab tsi yog PTH Flash plating

PTH Flash plating yog txheej txheem tseem ceeb hauv kev tsim cov txheej txheem ntawm PCB (luam tawm Circuit Board). Nws lub hom phiaj tseem ceeb thiab kev ua haujlwm yog txhawm rau tso cov txheej nyias nyias ntawm cov tshuaj tooj liab rau ntawm qhov tsis yog qhov hluav taws xob ntawm phab ntsa substrate uas tau drilled los ntawm cov txheej txheem tshuaj, thiaj li ua lub hauv paus rau cov electroplated tooj liab tom ntej. Hauv qab no yog cov lus piav qhia ntxaws ntawm flash tooj liab plating:

Lub hom phiaj thiab kev ua haujlwm ntawm PTH flash plating
Tsim kom muaj txheej txheej conductive: Tsim kom muaj txheej tuab thiab ruaj khov ntawm tooj liab hlau ua tus neeg xyuas pib ntawm cov phab ntsa insulating ntawm PCB pawg thawj coj saib, kom lub teeb liab tuaj yeem ua rau ntawm cov txheej txheem.
Raws li lub hauv paus plating: Cov txheej nyias nyias ntawm cov tshuaj tooj liab muab lub hauv paus zoo ib yam thiab cov khoom siv hluav taws xob rau cov electroplated tooj liab tom ntej, kom ntseeg tau qhov zoo thiab sib xws ntawm txheej electroplated.
Cov txheej txheem ntws ntawm PTH flash plating

• Deburring: Ua ntej tooj liab plating, tom qab lub PCB substrate undergoes cov txheej txheem drilling, burrs yog nquag tsim rau ntawm lub qhov ntug thiab sab hauv lub qhov phab ntsa, uas yuav tsum tau muab tshem tawm mechanically los tiv thaiv cov burrs los ntawm qhov zoo ntawm cov tom ntej tooj liab plating thiab electroplating.
• Alkaline degreasing: tshem tawm cov roj stains, ntiv tes, oxides thiab plua plav hauv lub qhov ntawm lub rooj tsavxwm saum npoo, thiab kho qhov polarity ntawm lub qhov phab ntsa substrate (kho lub qhov phab ntsa ntawm qhov tsis zoo rau qhov zoo) los pab txhawb cov adsorption tom ntej ntawm colloidal palladium.
• Roughening (micro-etching): me ntsis corrodes lub board nto kom roughness thiab nto ntawm lub board nto, thiab txhim kho lub adhesion thiab bonding quab yuam ntawm lub tom ntej no tooj liab txheej.
• Pre-impregnation, activation, thiab degumming: npaj rau cov txheej txheem tom ntej tooj liab deposition los ntawm kev kho tshuaj.
• Copper deposition: tso ib txheej nyias ntawm cov tshuaj tooj liab rau ntawm phab ntsa ntawm lub qhov thiab lub board nto raws li lub hauv paus rau tom ntej electroplated tooj liab. Lub thickness ntawm cov pa nyias tooj liab deposition feem ntau yog hais txog 0.5μm.
• Acid immersion: muab qhov chaw acidic rau cov txheej txheem electroplating tom ntej kom ntseeg tau tias qhov zoo thiab sib xws ntawm cov txheej txheem electroplated.

Qhov zoo ntawm PTH flash plating
Ua kom cov tawv nqaij tsis zoo: tooj liab deposition siv activated palladium raws li lub qhov phab ntsa tooj liab bonding nruab nrab txheej, thiab embeds tooj liab ions rau hauv lub qhov phab ntsa kom ruaj khov txuas lawv mus rau lub qhov phab ntsa resin thiab lub puab tooj liab txheej.
Kev kub siab thiab ruaj khov: PCB boards tsim los ntawm cov txheej txheem tooj liab plating tuaj yeem ua haujlwm txuas ntxiv thiab ua kom lub zog muaj zog hauv qhov kub siab (xws li 288 degree) thiab qhov kub tsis tshua muaj (-25 degree) ib puag ncig.
Sau ntawv

1. Cov txheej txheem tooj liab plating yog qhov tseem ceeb rau qhov zoo ntawm PCB boards. Kev tswj cov txheej txheem tsis tas yuav tsum yog qhov tseeb, txwv tsis pub nws yooj yim ua rau muaj teeb meem zoo xws li lub qhov phab ntsa voids.
2. Cov txheej txheem deburring thiab alkaline degreasing ua ntej tooj liab plating yuav tsum tau siv nruj me ntsis kom ntseeg tau qhov zoo ntawm tooj liab plating thiab electroplating.
3. Piv nrog rau cov txheej txheem ua kua nplaum, cov txheej txheem tooj liab plating yog kim dua, tab sis nws muaj kev ntseeg siab dua thiab ruaj khov, thiab tsim nyog rau kev tsim cov PCB boards nrog cov kev xav tau zoo dua.