Aluminium substrate khoom nta

Aluminium substrate (hlau{{{0}}}raws li lub dab dej kub (xws li txhuas substrate, tooj liab substrate, hlau substrate)) yog tsawg-alloyed Al-Mg-Si series siab-yas alloy phaj (saib daim duab hauv qab no rau cov qauv), uas muaj thermal conductivity zoo, hluav taws xob rwb thaiv tsev Piv nrog rau cov tsoos FR-4, aluminium substrate txais tib lub thickness thiab tib txoj kab dav, aluminium substrate tuaj yeem nqa tau siab dua tam sim no, qhov kev tiv thaiv hluav taws xob ntawm aluminium substrate tuaj yeem ncav cuag 4500V, thiab thermal conductivity ntau dua 2.0. Kev lag luam yog dominated los ntawm aluminium substrates.

●Using surface mount technology (SMT);

Txoj kev teeb aluminium substrate

Txoj kev teeb aluminium substrate

●Effectively deal with heat diffusion in circuit design scheme;

●Reduce the operating temperature of the product, improve the power density and reliability of the product, and prolong the service life of the product;

● Reduce product volume, reduce hardware and assembly costs;

●Replace fragile ceramic substrate for better mechanical durability. structure

Aluminium-raws li tooj liab clad laminate yog cov khoom siv hlau hauv Circuit Court, uas muaj cov ntawv ci tooj liab, thermal rwb thaiv tsev txheej thiab hlau substrate. Nws cov qauv muab faib ua peb txheej:

Cireuitl.Layer Circuit Court txheej: sib npaug rau tooj liab clad laminate ntawm zoo tib yam PCB, lub thickness ntawm Circuit Court tooj liab ntawv ci yog loz rau 10oz.

DielcctricLayer insulating layer: The insulating layer is a layer of thermally conductive insulating material with low thermal resistance. Thickness: {{0}}.003" to 0.006" inch is the core technology of aluminum-based copper clad laminate, which has obtained UL certification.

BaseLayer: Nws yog hlau substrate, feem ntau yog txhuas lossis tooj liab xaiv. Aluminium puag tooj liab clad laminate thiab tsoos epoxy iav ntaub laminate, thiab lwm yam.

Piv nrog rau lwm cov ntaub ntawv, cov ntaub ntawv PCB muaj qhov zoo sib xws. Haum rau nto mount SMT pej xeem kos duab ntawm lub hwj chim Cheebtsam. Tsis xav tau lub tshuab hluav taws xob, qhov ntim tau txo qis heev, cov nyhuv tshav kub yog qhov zoo heev, thiab kev ua haujlwm rwb thaiv tsev thiab kev ua haujlwm zoo.

Aluminium substrate rau fluorescent teeb

Aluminium substrate rau fluorescent teeb

LED tuag substrate feem ntau yog siv los ua qhov nruab nrab rau kev hloov hluav taws xob ntawm LED tuag thiab qhov system Circuit Court board, thiab ua ke nrog LED tuag los ntawm cov txheej txheem ntawm kev sib txuas, eutectic lossis flip nti. Raws li kev xav txog cov cua kub dissipation, LED tuag substrates ntawm kev ua lag luam feem ntau yog ceramic substrates, uas tuaj yeem muab faib ua peb hom: tuab -film ceramic substrates, qis-kub co- raug rho tawm haujlwm ntau txheej ceramics, thiab nyias -zaj duab xis ceramic substrates raws li kev npaj sib txawv. Rau siab- fais fab LED Cheebtsam, tuab- zaj duab xis lossis qis-kub co- raug rho tawm haujlwm ceramic substrates feem ntau yog siv los ua cov khoom siv hluav taws xob tuag, thiab tom qab ntawd LED tuag thiab ceramic substrate tau ua ke nrog cov xov hlau kub. Raws li tau hais nyob rau hauv kev taw qhia, qhov kev sib txuas ntawm cov xov tooj kub no txwv qhov kev ua haujlwm ntawm cov cua sov dissipation raws cov electrode hu. Yog li ntawd, cov tuam txhab tsim khoom hauv tsev thiab txawv teb chaws tau ua haujlwm hnyav los daws qhov teeb meem no. Muaj ob txoj kev daws teeb meem. Ib qho yog nrhiav cov khoom siv substrate nrog cov kub kub dissipation coefficient los hloov aluminium oxide, suav nrog silicon substrate, silicon carbide substrate, anodized aluminium substrate lossis aluminium nitride substrate. Ntawm lawv, silicon thiab silicon carbide substrates yog cov khoom siv semiconductor. Txawm li cas los xij, anodized aluminium substrate yog nquag tawg vim lub zog tsis txaus ntawm anodized oxide txheej, uas txwv nws txoj kev siv. Qhov ntau tus paub tab thiab feem ntau lees txais ib qho yog siv aluminium nitride raws li cov cua kub dissipation substrate; Txawm li cas los xij, cov txheej txheem ua yeeb yaj kiab ib txwm tsis haum rau txhuas nitride substrate (cov khoom siv yuav tsum tau kho cua sov ntawm 850 degree tom qab cov nyiaj muab tshuaj txhuam los ua kom nws cov khoom muaj teeb meem kev ntseeg siab), yog li ntawd, aluminium nitride substrate Circuit Court yuav tsum tau npaj. los ntawm nyias zaj duab xis txheej txheem. Cov txheej txheem ua yeeb yaj kiab uas npaj tau los ntawm cov khoom siv hluav taws xob ua kom sov los ntawm cov txheej txheem LED rau ntawm cov kab ke hluav taws xob board los ntawm cov hlau xaim , yog li ua tiav high heat dissipation Effect