FPC nto plating kev paub
Jun 25, 2022
Flexible Circuit Board FPC plating
(1) Pretreatment ntawm FPC electroplating Qhov saum npoo ntawm tus neeg xyuas pib tooj liab tawm los ntawm FPC tom qab txheej txheem txheej yuav raug paug los ntawm cov nplaum los yog number case, nrog rau oxidation thiab discoloration los ntawm cov txheej txheem kub. Ib txheej nruj nrog adhesion zoo yuav tsum tshem tawm cov kab mob thiab oxide txheej ntawm tus neeg xyuas pib nto thiab ua kom tus neeg xyuas pib huv.
Txawm li cas los xij, qee qhov ntawm cov kab mob no tau sib xyaw ua ke nrog tooj liab conductors, thiab tsis tuaj yeem tshem tawm tag nrho nrog cov tshuaj ntxuav tsis muaj zog. Yog li ntawd, feem ntau ntawm lawv yog feem ntau kho nrog alkaline abrasives nrog ib tug tej yam lub zog thiab polishing txhuam. Feem ntau ntawm cov txheej nplaum yog lub nplhaib-puab. Oxygen resins muaj cov alkali tsis zoo, uas yuav ua rau txo qis hauv kev sib raug zoo. Txawm hais tias nws tsis pom tseeb, hauv cov txheej txheem FPC electroplating, cov txheej txheem plating tuaj yeem nkag mus los ntawm ntug ntawm txheej txheej, thiab hauv qhov xwm txheej hnyav, txheej txheej yuav raug tev tawm. . Qhov tshwm sim ntawm solder drilling nyob rau hauv lub overlay tshwm sim thaum kawg soldering. Nws tuaj yeem hais tias cov txheej txheem ua ntej kev kho mob yuav muaj kev cuam tshuam loj rau cov yam ntxwv ntawm cov ntawv luam tawm yooj yim F{C, thiab kev saib xyuas tag nrho yuav tsum tau them rau cov txheej txheem ua haujlwm.
(2) Thickness ntawm FPC electroplating Thaum electroplating, lub deposition ceev ntawm cov electroplated hlau yog ncaj qha ntsig txog qhov hluav taws xob teb siv, thiab hluav taws xob siv zog hloov nrog cov duab ntawm cov qauv Circuit Court thiab cov positional kev sib raug zoo ntawm cov electrodes. Lub sharper qhov taw tes, qhov ze ntawm qhov kev ncua deb ntawm electrode, lub zog hluav taws xob ntau dua, thiab cov txheej tuab ntawm qhov ntawd. Hauv cov ntawv thov cuam tshuam nrog cov ntawv luam tawm yooj yim, muaj ntau qhov xwm txheej uas qhov dav ntawm ntau cov xov hlau nyob hauv tib lub voj voog sib txawv heev, uas ua rau nws yooj yim dua los tsim cov thickness tsis sib xws. Txhawm rau tiv thaiv qhov no los ntawm qhov tshwm sim, tus qauv shunt cathode tuaj yeem txuas nrog ib ncig ntawm lub voj voog. , nqus cov tsis sib xws tam sim no faib rau ntawm cov qauv electroplating, thiab xyuas kom meej tias lub thickness ntawm txheej ntawm txhua qhov chaw yog sib xws rau qhov loj tshaj plaws.
Yog li ntawd, kev siv zog yuav tsum tau ua nyob rau hauv cov qauv ntawm cov electrodes. Ib qho kev daws teeb meem sib haum xeeb tau thov ntawm no. Cov qauv rau cov khoom uas muaj kev xav tau siab ntawm qhov sib xws ntawm cov txheej txheej yog nruj, thiab cov qauv rau lwm qhov chaw muaj kev sib haum xeeb, xws li cov hlau lead-tin plating rau fusion vuam, kub-plating rau hlau hlau ncej (welding), thiab lwm yam. . Siab, thiab dav dav los tiv thaiv corrosion lead-tin plating, plating thickness yuav tsum tau so.
(3) Tsis muaj teeb meem nrog cov smudges thiab av ntawm FPC electroplating, tshwj xeeb tshaj yog cov tsos ntawm cov tshiab plated txheej. Txawm li cas los xij, qee qhov chaw yuav tshwm sim smudges, av, discoloration thiab lwm yam tshwm sim sai sai tom qab, tshwj xeeb tshaj yog thaum lub Hoobkas kuaj tsis pom. Dab tsi yog qhov txawv, tab sis thaum tus neeg siv tshuaj xyuas qhov kev txais tos, nws pom tias muaj teeb meem tshwm sim. Qhov no yog tshwm sim los ntawm tsis txaus drifting thiab residual plating tov nyob rau saum npoo ntawm lub plating txheej, uas maj mam undergoes tshuaj tiv thaiv nyob rau hauv ib lub sij hawm ntawm lub sij hawm. Tshwj xeeb, cov ntawv luam tawm yooj yim tsis yog tiaj tus vim nws cov softness, thiab ntau yam kev daws teeb meem zoo li "sau?" nyob rau hauv nws recesses, thiab ces react nyob rau hauv no seem thiab hloov xim. Txhawm rau tiv thaiv qhov no los ntawm qhov tshwm sim, tsis tsuas yog yuav tsum tau tag nrho drifted, tab sis kuj yuav tsum tau qhuav tag nrho. Nws tuaj yeem paub tseeb tias qhov drift puas txaus los ntawm kev ntsuas kub thermal aging.
Flexible Circuit Board FPC electroless plating
Thaum cov kab hluav taws xob yuav tsum tau plated raug rho tawm thiab tsis tuaj yeem siv los ua electrode, tsuas yog electroless plating tuaj yeem ua tau. Feem ntau, cov da dej siv hauv electroless plating muaj cov tshuaj muaj zog, thiab cov txheej txheem electroless kub plating yog ib qho piv txwv. Electroless kub plating tov yog ib qho alkaline aqueous tov nrog tus nqi pH siab heev. Thaum siv cov txheej txheem electroplating no, nws yog qhov yooj yim rau cov txheej txheem plating kom nkag mus rau hauv qab txheej txheej, tshwj xeeb tshaj yog yog tias qhov kev tswj xyuas zoo ntawm cov txheej txheem txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej tsis nruj me ntsis, thiab lub zog sib khi tsis tshua muaj, qhov teeb meem no yuav tshwm sim.
Vim yog cov yam ntxwv ntawm cov tshuaj plating, cov electroless plating ntawm cov tshuaj tiv thaiv kev hloov pauv ntau dua rau qhov tshwm sim uas cov tshuaj plating nkag mus rau hauv txheej txheej, thiab nws yog qhov nyuaj kom tau txais cov txheej txheem plating zoo los ntawm cov txheej txheem no.
Flexible Circuit Board FPC cua kub theem
Cov cua kub theem yog Ameslikas yog ib qho cuab yeej tsim los rau txheej txhuas thiab tin ntawm cov ntawv luam tawm nruj. Vim qhov yooj yim ntawm cov thev naus laus zis no, nws kuj tseem siv rau cov ntawv luam tawm yooj yim (FPC). Cua kub leveling yog ncaj qha mus rau hauv lub rooj tsavxwm nyob rau hauv lub molten lead thiab tin da dej vertically, thiab cov tshaj solder yog tshuab nrog cua kub. Qhov xwm txheej no hnyav heev rau cov ntawv luam tawm yooj yim FPC. Yog tias cov ntawv luam tawm yooj yim FPC tsis tuaj yeem muab tso rau hauv cov khoom siv yam tsis muaj kev ntsuas, cov ntawv luam tawm yooj yim FPC yuav tsum tau muab sib xyaw ntawm cov tshuaj pleev ib ce ua los ntawm cov hlau titanium, thiab tom qab ntawd muab tso rau hauv cov molten solder. Tau kawg, qhov chaw ntawm cov ntawv luam tawm yooj yim FPC yuav tsum tau ntxuav thiab ua ntej.
Vim yog qhov hnyav ntawm cov txheej txheem huab cua kub, nws yog ib qho yooj yim rau lub solder laum los ntawm qhov kawg ntawm lub npog txheej mus rau hauv qab ntawm lub npog txheej, tshwj xeeb tshaj yog thaum lub zog sib txuas ntawm lub hau txheej thiab qhov chaw ntawm cov tooj liab. ntawv ci yog tsawg, qhov tshwm sim no feem ntau tshwm sim ntau zaus. Txij li cov zaj duab xis polyimide yog ib qho yooj yim los nqus dej noo, thaum siv cov cua kub theem txheej txheem, cov dej noo absorbed los ntawm cov dej noo yuav ua rau lub hau npog ua npuas ncauj lossis txawm tias tev tawm vim yog thermal evaporation sai. Yog li ntawd, ua ntej FPC cua kub leveling, nws yuav tsum tau qhuav thiab noo-pov thawj tswj.






