PCB kab rov tav electroplating technology qhia

I. Txheej txheem cej luam

Nrog rau txoj kev loj hlob sai ntawm microelectronics thev naus laus zis, kev tsim hluav taws xob hluav taws xob tsim hluav taws xob tau tsim sai heev hauv ntau txheej txheej, sib sau ua ke, ua haujlwm thiab sib xyaw ua ke. Txhawb kev tsim thiab tsim cov duab kos duab hauv Circuit Court nrog ntau qhov me me, qhov sib nrug nqaim, thiab cov ncauj lus qhia ntxaws ntxaws hauv kev tsim cov ntawv luam tawm, uas ua rau nws nyuaj rau luam tawm Circuit Board tsim tshuab, tshwj xeeb tshaj yog cov longitudinal ratio ntawm multi -txheej daim hlau ntau tshaj 5: 1 thiab cov tsub zuj zuj Ib tug loj tus naj npawb ntawm qhov muag tsis pom qhov tau txais nyob rau hauv txheej phaj ua rau cov pa ntsug electroplating txheej txheem tsis tau raws li cov kev cai ntawm high-zoo thiab high-reliability interconnection. Lub ntsiab yog vim li cas yuav tsum tau soj ntsuam los ntawm lub hauv paus ntsiab lus ntawm electroplating lub tam sim no faib lub xeev. Los ntawm qhov tseeb electroplating, qhov kev faib tawm ntawm qhov tam sim no hauv lub qhov nthuav qhia lub duav nruas zoo li. Lub ntug ntawm lub qhov tsis tuaj yeem ua kom cov txheej txheem tuab ntawm txheej tooj liab uas cov txheej tooj liab nyob rau hauv nruab nrab ntawm lub qhov xav tau. Qee lub sij hawm cov txheej tooj liab yog qhov nyias nyias lossis tsis yog-tooj ​​liab txheej, uas yuav ua rau tsis muaj kev puas tsuaj thaum muaj xwm txheej hnyav, ua rau muaj ntau ntawm cov txheej txheem ntau txheej. Yuav kom daws tau qhov zoo ntawm cov khoom loj hauv kev tsim khoom loj, cov teeb meem sib sib zog nqus-qhov plating tam sim no tau daws los ntawm cov khoom tam sim no thiab cov khoom siv ntxiv. Nyob rau hauv lub siab - ntsug thiab kab rov tav -rau -printed Circuit Court board electroplating txheej txheem, lawv feem ntau yog nyob rau hauv lub auxiliary nyhuv ntawm high-zoo additives, ua ke nrog nruab nrab cua stirring thiab cathode txav, thiab nyob rau hauv cov kev mob ntawm kuj tsis tshua muaj tam sim no ceev. Ua kom cov tshuaj tiv thaiv electrode tswj cheeb tsam hauv lub qhov, lub luag haujlwm ntawm electroplating additive tuaj yeem tshwm sim. Tsis tas li ntawd, lub zog cathode yog qhov zoo heev rau kev txhim kho qhov sib sib zog nqus plating muaj peev xwm ntawm cov kua plating. Kev tsim ceev ntawm cov siv lead ua nucleus yog them rau ib leeg nrog kev loj hlob ntawm cov nplej, thiaj li tau txais cov txheej txheem tooj liab siab.

Txawm li cas los xij, thaum qhov sib piv ntsug thiab kab rov tav ntawm lub qhov txuas ntxiv nce lossis muaj qhov tsis pom qhov tob, ob qhov kev ntsuas no zoo li tsis muaj zog, yog li cov kab rov tav plating tshuab yog tsim. Nws yog qhov txuas ntxiv ntawm txoj kev loj hlob ntawm ntsug electroplating tshuab, uas yog, ib qho tshiab electroplating tshuab tsim los ntawm cov txheej txheem ntsug electroplating. Tus yuam sij rau kev siv tshuab no yog tsim kom muaj kev hloov pauv, txhawb nqa kab rov tav electroplating system, uas tuaj yeem ua rau cov txheej txheem plating uas tuaj yeem ua tau zoo heev. Nrog rau kev koom tes ntawm kev txhim kho txoj kev siv hluav taws xob thiab lwm yam khoom siv, nws qhia tau hais tias nws yog qhov zoo tshaj plaws ntawm txoj kev ntsug electroplating. Cov teebmeem ua haujlwm.

2. Taw qhia rau lub hauv paus ntsiab lus ntawm kab rov tav plating

Txoj kev kab rov tav electroplating thiab txoj cai ntawm ntsug plating yog tib yam, thiab lawv yuav tsum muaj yin thiab yang ncej. Tom qab lub hwj chim-on, cov tshuaj tiv thaiv electrode yog tsim los tsim cov electrolyte cov khoom xyaw tseem ceeb, kom cov ion zoo nrog cov hluav taws xob ion txav mus rau thaj tsam electrode. Lub sijhawm zoo ntawm thaj chaw cov tshuaj tiv thaiv txav mus, yog li cov hlau sedimentary txheej thiab cov pa roj raug tsim tawm. Vim tias cov txheej txheem ntawm cov hlau hauv cathode deposition tau muab faib ua peb kauj ruam: uas yog, cov hlau hydration ion kis mus rau cathode; Cov kauj ruam thib ob yog maj mam dehydrate thaum cov hlau hydraulic ions maj mam dehydrated thiab adsorbed ntawm cathode nto; Kauj ruam thib peb yog adsize hlau ions nyob rau saum npoo ntawm lub cathode kom tau txais electrons thiab nkag mus rau hauv cov hlau lattice. Los ntawm qhov kev soj ntsuam tiag tiag mus rau qhov chaw ua haujlwm, qhov tsis tuaj yeem soj ntsuam cov lus teb ntawm alien electron kis tau tus mob ntawm cov electrode ntawm cov khoom theem thiab cov kua theem plating kua. Nws cov qauv tuaj yeem piav qhia los ntawm ob txoj hauv kev electro-txheej txheej hauv txoj kev xav electroplating. Thaum lub electrode yog cathode thiab nyob rau hauv ib tug polarized lub xeev, nws yog surrounded los ntawm dej molecules thiab ib tug zoo charged cation. Nyob ze, txheej txheej ntawm Helmholtz, uas nyob rau ntawm qhov chaw nruab nrab ze ntawm qhov chaw cationic center point, yog li ntawm 1-10 nanometers los ntawm electrode. Txawm li cas los xij, vim tag nrho cov nqi zoo nqa los ntawm cation ntawm txheej txheej Heimhoz, tus nqi zoo tsis txaus los cuam tshuam cov nqi tsis zoo ntawm lub cathode. Lub plating kua nyob deb ntawm lub cathode yog cuam tshuam los ntawm qhov ntws, thiab cov cation concentration ntawm cov txheej txheem txheej yog siab tshaj qhov aion concentration. Vim tias cov nyhuv zoo li qub yog me dua li txheej txheej ntawm Hemhzhitz, thiab nws kuj tseem cuam tshuam los ntawm thermal txav, qhov tso tawm ntawm cations tsis yog ze thiab zoo li txheej txheej ntawm Hemhzhitz. Cov txheej no yog hu ua diffusion txheej. Lub thickness ntawm lub diffusion txheej yog inversely proportional rau qhov txaus tus nqi ntawm plating kua. Ntawd yog, qhov nrawm nrawm ntawm cov kua plating, lub thinner lub diffusion txheej, tab sis lub thickness, thiab lub thickness ntawm lub dav diffusion txheej yog li ntawm 5-50 microns. Nws nyob deb ntawm lub cathode. Vim hais tias tam sim no ntawm cov tshuaj generated yuav cuam tshuam cov uniformity ntawm cov concentration ntawm cov tshuaj plating. Cov tooj liab ions nyob rau hauv lub diffusion txheej yog thauj mus rau txheej txheej ntawm Heimhoz los ntawm diffusion thiab migration ntawm ions. Txawm li cas los xij, tooj liab ions nyob rau hauv lub ntsiab plating tov yog thauj mus rau cathode nto los ntawm cov nyhuv tiag tiag thiab ion tsiv teb tsaws. Thaum lub sij hawm kab rov tav plating txheej txheem, tooj liab ions nyob rau hauv lub plating tov yog thauj mus rau ze lub cathode los ntawm peb txoj kev los tsim ib tug dual electrocomputer.

Lub cim ntawm plating tov yog qhov ntws ntawm sab nraud sab hauv nrog cov tshuab nplawm thiab lub twj tso kua mis nplawm, viav vias lossis tig ntawm cov electrode nws tus kheej, thiab cov dej ntws ntawm electroplating los ntawm qhov kub thiab txias. Qhov ze dua rau saum npoo ntawm cov khoom siv hluav taws xob, qhov cuam tshuam ntawm kev sib txhuam tsis zoo ua rau cov dej ntws ntawm cov plating ua kom qeeb thiab qeeb. Lub sijhawm no, tus nqi convection ntawm cov khoom electrode nto yog xoom. Los ntawm cov electrode nto mus rau cov txheej txheem ntws ntawm cov kwj plating kua, cov txheej txheem ntws yog hu ua flow interface txheej. Lub thickness ntawm cov ntws interface txheej yog kwv yees li kaum npaug ntawm cov thickness ntawm cov diffusion txheej, yog li cov kev thauj mus los ntawm ions nyob rau hauv lub diffusion txheej yog tsis tshua muaj cuam tshuam los ntawm cov ntws.

Raws li kev cuam tshuam ntawm hluav taws xob, cov ions hauv cov kua dej electroplating yog lub zog zoo li qub thiab cov ion conveyor hu ua ion migration. Tus nqi ntawm nws tsiv teb tsaws yog raws li nram no: U=Zeoe/6πrη. Ntawm lawv, U yog ib qho kev txav mus los, tus naj npawb ntawm cov nqi ntawm ionic ions, EO yog tus nqi ntawm ib qho hluav taws xob (uas yog, 1.61019c), E raws li muaj peev xwm, R vojvoog ntawm hydraulic ions, thiab viscosity ntawm plating kua. Raws li kev suav ntawm qhov sib npaug, qhov loj dua qhov muaj peev xwm E, qhov me dua qhov viscosity ntawm cov kua electroplating, thiab qhov ceev ntawm ion tsiv teb tsaws.

Raws li txoj kev xav ntawm hluav taws xob deposition, thaum electroplating, luam tawm Circuit Court board ntawm lub cathode yog ib qho tsis zoo polarized electrode. Copper ions adsorbed rau ntawm qhov chaw cathode yog siv kom tau txais cov hluav taws xob thiab rov qab mus rau tooj liab atoms, kom cov concentration ntawm tooj liab ions ze ntawm cathode txo. Yog li ntawd, tooj liab ion concentration gradient yog tsim nyob ze ntawm lub cathode. Cov txheej txheej ntawm cov kua plating no nrog qis qis ntawm tooj liab ions tshaj qhov concentration ntawm cov plating tseem ceeb yog cov txheej txheej ntawm cov txheej txheem plating. Cov tooj liab ion concentration nyob rau hauv lub ntsiab plating tov yog siab, uas yuav kis tau mus rau qhov chaw nrog qis tooj liab ions nyob ze ntawm lub cathode, uas yuav kis mus tas li ntxiv lub cathode cheeb tsam. Printing Circuit Court board zoo ib yam li lub dav hlau cathode, thiab kev sib raug zoo ntawm qhov loj ntawm qhov tam sim no thiab lub thickness ntawm diffusion txheej yog COTTRLLL sib npaug:

Ntawm lawv, kuv yog tam sim no, tus naj npawb ntawm tooj liab ions yog tooj liab ions, F yog Faraday zaus, A yog qhov chaw cathode, D yog tooj liab ion diffusion coefficient (D=KT / 6πrη), CB yog tooj liab ion concentration nyob rau hauv lub ntsiab plating, thiab cov CO yog lub cathode ncej. Qhov concentration ntawm tooj liab ions, D yog lub thickness ntawm diffusion txheej, K yog Boshiman tas li (K=R / N), T yog kub, R yog lub vojvoog ntawm tooj liab-dej ion, thiab viscosity ntawm cov kua plating. Thaum cov tooj liab ion concentration ntawm lub cathode nto yog xoom, nws tam sim no hu ua huab diffusion tam sim no II:

Nws tuaj yeem pom los ntawm cov qauv saum toj no tias qhov loj ntawm qhov txwv diffusion tam sim no txiav txim siab tooj liab ion concentration ntawm lub ntsiab plating kua, diffusion coefficient ntawm tooj liab ion, thiab lub thickness ntawm diffusion txheej. Thaum lub concentration ntawm tooj liab ions nyob rau hauv lub ntsiab plating tov, lub diffusion coefficient ntawm tooj liab ions yog loj, thiab lub thickness ntawm diffusion txheej yog nyias, qhov loj dua qhov txwv diffusion tam sim no.
Raws li cov qauv saum toj no, kom ncav cuag tus nqi siab dua tam sim no, cov txheej txheem tsim nyog yuav tsum tau ua, uas yog, cov txheej txheem cua sov tau txais yuav. Vim tias qhov ntsuas kub siab tuaj yeem ua rau qhov diffusion coefficient loj dua, qhov nce ntxiv tuaj yeem ua rau nyias thiab nyias txheej. Los ntawm cov saum toj no theoretical tsom xam, ua rau cov tooj liab ion concentration nyob rau hauv lub ntsiab plating tov, ua kom kub ntawm cov plating tov, thiab ua kom tus nqi txaus yuav ua rau kom cov huab diffusion tam sim no, thiab ua tiav lub hom phiaj ntawm accelerating lub electroplating tus nqi. Txoj kab rov tav electroplating yog raws li qhov nrawm ntawm qhov sib nqus ntawm cov txheej txheem plating thiab tsim cov vortex, uas tuaj yeem txo qhov tuab ntawm cov txheej txheej diffusion mus txog 10 microns. Yog li ntawd, thaum lub kab rov tav plating system yog siv rau electroplating, nws tam sim no ceev yuav siab li 8A / DM2.

Tus yuam sij rau kev luam ntawv Circuit Court board electroplating yog yuav ua li cas los xyuas kom meej lub uniformity ntawm lub thickness ntawm tooj liab txheej ntawm lub puab phab ntsa ntawm lub puab phab ntsa ntawm lub substrate. Txhawm rau kom tau txais qhov sib npaug ntawm cov tuab ntawm txheej, nws yog ib qho tsim nyog yuav tsum xyuas kom meej tias ob sab ntawm cov ntawv luam tawm thiab cov dej plating hauv qhov pores yuav tsum ceev thiab zoo ib yam kom tau txais cov txheej nyias nyias thiab sib txawv. Txhawm rau kom ncav cuag cov txheej txheem ntawm Bojuyi, raws li cov qauv tam sim no ntawm kab rov tav plating system, txawm hais tias muaj ntau cov tshuaj tsuag torches tau nruab rau hauv lub cev, cov plating tuaj yeem raug txau sai sai rau hauv cov ntawv luam tawm kom nrawm nrawm ntawm cov kua plating hauv cov dej. qhov nyob rau hauv lub pores. Qhov ceev ua rau tus nqi ntws ntawm cov kua plating ceev ceev. Tsim cov eddy tam sim no nyob rau hauv lub Upper thiab qis qhov ntawm lub substrate, uas txo cov diffusion txheej thiab yog ib tug sib xws. Txawm li cas los xij, thaum cov kua plating dheev ntws mus rau hauv qhov nqaim, cov kua dej plating ntawm qhov nkag ntawm qhov pores kuj yuav rov qab los. Tsis tas li ntawd, qhov cuam tshuam ntawm kev faib tawm tam sim no, uas feem ntau ua rau electroplating ntawm lub qhov nkag. Vim lub thickness ntawm cov tooj liab txheej, lub puab phab ntsa ntawm lub qhov dhau los ua ib tug tooj liab txheej ntawm tus dev cov pob txha zoo. Raws li lub xeev ntawm ntws nyob rau hauv lub pores nyob rau hauv lub pores, uas yog, qhov luaj li cas ntawm lub vortex thiab rov qab ntws, lub xeev kev soj ntsuam ntawm qhov zoo ntawm cov electroplated pores tsuas yog txiav txim los ntawm tus txheej txheem xeem txoj kev los txiav txim lub uniformity ntawm lub pores. tswj qhov ntsuas kom ua tiav qhov tuab ntawm electrophus plating ntawm lub rooj tsav xwm Circuit Court. Vim tias qhov loj ntawm vortex thiab backflow tseem tsis tuaj yeem paub qhov theoretical laij lej, tsuas yog siv txoj kev ntsuas ntsuas. Nws tau kawm los ntawm kev ntsuas qhov ntsuas tau los tswj qhov sib xws ntawm lub thickness ntawm tooj liab coated txheej ntawm lub qhov, nws yog ib qho tsim nyog yuav tsum tau kho cov txheej txheem tswj tau raws li qhov sib piv ntsug ntawm qhov dhau ntawm lub rooj tsav xwm hauv Circuit Court, thiab txawm xaiv. high-decentralized electroplating tooj liab tov. Tom qab ntawd ntxiv cov khoom ntxiv tsim nyog thiab txhim kho txoj kev siv hluav taws xob, thiab siv cov mem tes rov qab rau electroplating kom tau txais tooj liab plating nrog lub peev xwm loj.

Hauv particular, tus naj npawb ntawm micro-dig muag qhov nyob rau hauv cov phaj tsub zuj zuj, tsis tsuas yog kab rov tav electroplating system yog siv rau electroplating, tab sis kuj ultrasonic kev co los txhawb kev hloov thiab ncig ntawm plating kua nyob rau hauv lub micro - dig muag qhov. Cov ntaub ntawv tuaj yeem hloov kho los kho cov kev tswj tsis tau kom tau txais txiaj ntsig zoo.

3. Cov qauv yooj yim ntawm kab rov tav plating system

Raws li cov yam ntxwv ntawm kab rov tav electroplating, nws yog txoj kev electroplating ntawm plating lub tshuab luam ntawv Circuit Court board los ntawm ntsug daim ntawv mus rau ib tug parallel plating kua. Nyob rau lub sijhawm no, lub rooj tsav xwm luam tawm yog cathode, thiab kab rov tav plating system ntawm cov khoom siv tam sim no siv cov khoom siv hluav taws xob thiab cov khoom siv hluav taws xob. Txhawm rau tham txog qhov yooj yim ntawm kev khiav hauj lwm qhov system, cov khoom siv ntawm cov dov log conductivity yog ntau dua. Ntxiv nrog rau cov cathode, cov khoom siv hluav taws xob nyob rau hauv kab rov tav plating system kuj muaj kev ua haujlwm ntawm kev xa tawm thiab luam tawm Circuit Board. Txhua lub tshuab hluav taws xob yog nruab nrog lub caij nplooj ntoos hlav, uas tuaj yeem hloov kho raws li qhov xav tau ntawm electroplating ntawm lub rooj tsavxwm luam tawm ({{0}}}10-500mm) ntawm qhov sib txawv tuab. Txawm li cas los xij, thaum electroplating, qhov chaw nyob rau hauv kev sib cuag nrog cov kua plating yuav raug plated nrog ib txheej tooj liab, thiab lub cev tsis tuaj yeem khiav mus ntev. Yog li, feem ntau ntawm cov kab rov tav electroplating tam sim no yog tsim los hloov cov cathode rau hauv anode, thiab tom qab ntawd siv cov txheej txheem cathode kom yaj cov tooj liab electrolyte ntawm lub log coated. Rau kev txij nkawm lossis hloov, tus qauv tshiab electroplating kuj tseem siv rau hauv tus account cov cheeb tsam uas pheej poob rau qhov yooj yim disassembly lossis hloov. Lub anode yog lub pob tawb titanium insoluble uas tuaj yeem kho qhov loj ntawm cov array, muab tso rau hauv cov haujlwm sab saud thiab qis ntawm cov ntawv luam tawm Circuit Board, raws li. Sab hauv muaj ib txoj kab uas hla ntawm 25 hli spherical, phosphorus cov ntsiab lus yog 0.04-0.06 feem pua ​​​​kho tau tooj liab, cathode, thiab anode. Qhov kev ncua deb yog 40mm.

Cov dej ntws ntawm plating kua yog ib qho system tsim los ntawm cov twj tso kua mis thiab lub nozzle, kom cov kua plating ntws sai sai rau pem hauv ntej ntawm qhov zawj kaw, thiab nws tuaj yeem ua kom ntseeg tau qhov nruab nrab ntawm cov kua dej ntws. Cov tshuaj plating yog vertically txau mus rau lub rooj tsav xwm luam tawm, thiab cov ntawv luam tawm Circuit Board nto ua phab ntsa dav hlau vortex. Nws lub hom phiaj ua tiav qhov nrawm nrawm ntawm cov kua dej plating ntawm ob sab ntawm lub rooj tsav xwm luam ntawv thiab cov dej nyab ntawm lub qhov los ua ib qho vortex. Tsis tas li ntawd, lub tshuab lim tau nruab rau hauv qhov zawj, uas yog siv rau hauv thaj tsam ntawm 1.2 microns los siv cov granular impurities generated thaum lub sij hawm electroplating txheej txheem los xyuas kom meej qhov huv si thiab muaj kuab paug ntawm cov tshuaj plating.

Thaum tsim cov kab rov tav plating tshuab, nws tseem yuav tsum tau xav txog kev ua haujlwm yooj yim thiab tsis siv neeg tswj cov txheej txheem tsis siv neeg. Vim hais tias nyob rau hauv qhov tseeb electroplating, nrog rau qhov loj ntawm qhov loj ntawm lub rooj tsavxwm, qhov loj ntawm qhov loj ntawm qhov pores, thiab qhov sib txawv tooj liab thickness xav tau, qhov ceev ntawm kev sib kis, qhov deb ntawm lub tshuab luam ntawv, qhov loj ntawm lub twj tso kua mis. horsepower, spraying peony Qhov teeb tsa ntawm cov txheej txheem tsis xws li kev taw qhia thiab qhov ceev tam sim no yuav tsum tau kuaj thiab kho thiab tswj kom tau txais cov thickness ntawm cov txheej tooj liab uas ua tau raws li cov kev cai. Computers yuav tsum tau tswj. Txhawm rau txhim kho qhov sib xws thiab kev ntseeg siab ntawm kev tsim khoom zoo thiab cov khoom lag luam zoo, kev kho rau pem hauv ntej thiab nram qab ntawm cov ntawv luam tawm Circuit Board (nrog rau lub plating qhov) raws li cov txheej txheem txheej txheem, ua tiav kab rov tav plating. system, uas ua tau raws li txoj kev loj hlob thiab cov npe ntawm cov khoom tshiab. xav tau.

Plaub, kev txhim kho kom zoo dua ntawm kab rov tav plating

Txoj kev loj hlob ntawm kab rov tav electroplating tshuab tsis yog qhov yuam kev, tab sis qhov xav tau ntawm high-density, high-precision, multi-function, multi-function, siab ntsug thiab kab rov tav -rau -multi-layer-to-multi-layered circuit board khoom. Nws qhov kom zoo dua yog tias nws yog ntau tshaj li cov txheej txheem ntsug plating siv tam sim no, cov khoom lag luam zoo dua txhim khu kev qha, thiab nws tuaj yeem ua tiav cov khoom loj. Nws muaj qhov zoo hauv qab no piv rau cov txheej txheem ntsug electroplating:

(1) Kho kom haum rau ntau qhov loj me, tsis tas yuav tsum tau nqa tawm tes-mounted, paub txhua yam kev ua haujlwm tsis siv neeg, uas tsis muaj kev phom sij rau kev txhim kho thiab ua kom ntseeg tau tias cov txheej txheem ua haujlwm tsis muaj kev puas tsuaj rau saum npoo ntawm substrate, thiab tsis tshua muaj siab. muaj txiaj ntsig zoo rau kev tsim khoom loj ntawm kev tsim khoom loj.

(2) Nyob rau hauv cov txheej txheem kev tshuaj xyuas, tsis tas yuav tsum tau tawm ntawm txoj hauj lwm ntawm lub clamp kom nce qhov kev ua tau zoo thiab txuag cov ntaub ntawv tsis zoo.

(3) Kab rov tav electroplating yog tswj los ntawm tag nrho cov txheej txheem los ua kom cov substrates yuav tsum xyuas kom meej tias qhov chaw ntawm qhov chaw ntawm lub rooj tsavxwm thiab cov txheej txheej ntawm cov txheej txheem ntawm Circuit Court board yog ib qho zoo ib yam.

(4) Los ntawm qhov kev xav ntawm kev tswj hwm, qhov zawj electroplating tuaj yeem paub txog kev ua haujlwm ntawm kev tu thiab electroplating kua, uas yuav tsis ua rau kev tswj tsis tau ntawm kev tswj xyuas vim yog kev ua yuam kev.

(5) Nws paub los ntawm cov khoom siv tiag tiag. Vim yog siv ntau txoj kab rov tav tu ntawm kab rov tav electroplating, nws txuag tau zoo heev ntawm cov dej ntxuav thiab txo qhov siab ntawm cov dej phwj tuaj kho.

(6) Vim tias lub kaw lus siv lub kaw lus kaw los txo qhov cuam tshuam ncaj qha ntawm cov pa phem ntawm qhov chaw ua haujlwm thiab cov evaporation ntawm calories ntawm cov txheej txheem, nws tau txhim kho qhov chaw ua haujlwm zoo heev. Tshwj xeeb, vim txo qis cov calories thaum lub sij hawm ci, kev siv tsis zoo ntawm lub zog txuag lub zog thiab txhim kho kev ua haujlwm zoo.

5. Cov ntsiab lus

Qhov tshwm sim ntawm kab rov tav electroplating tshuab yog kiag li kom tau raws li qhov xav tau ntawm siab ntsug thiab kab rov tav pores. Txawm li cas los xij, vim qhov nyuaj thiab tshwj xeeb ntawm cov txheej txheem electroplating, tseem muaj ntau yam teeb meem hauv kev tsim thiab txhim kho qib electroplating system. Qhov no yuav tsum tau txhim kho hauv kev xyaum. Txawm li cas los xij, kev siv kab rov tav electroplating tshuab yog ib qho kev txhim kho zoo thiab kev vam meej rau kev lag luam luam ntawv. Vim tias kev siv cov khoom siv no hauv kev tsim cov khoom siv high-density thiab multi-layer boards qhia tau hais tias muaj peev xwm zoo, nws tuaj yeem tsis tsuas yog txuag cov neeg ua haujlwm thiab lub sijhawm ua haujlwm, tab sis kuj ua rau qhov nrawm thiab ua haujlwm tau zoo dua li cov kab ntsug ntsug electroplating. Tsis tas li ntawd, txo qis kev siv hluav taws xob thiab txo cov dej khib nyiab rau cov dej khib nyiab uas yuav tsum tau ua, thiab txhim kho cov txheej txheem ib puag ncig thiab cov xwm txheej ntawm cov txheej txheem, thiab txhim kho cov txheej txheem electroplating zoo. Kab rov tav plating kab yog tsim rau loj-scale tso zis 24 - teev uninterrupted ua hauj lwm. Kab rov tav plating kab yog me ntsis nyuaj dua li ntsug plating kab thaum debugging. Thaum qhov kev debugging tiav, nws ruaj khov heev. Kho cov tshuaj plating kom ntseeg tau tias kev ua haujlwm ruaj khov mus ntev.